Multi-cascade thermoelectric device and manufacturing method thereof

Abstract

A multi-cascade thermoelectric device includes a packaging sleeve and a power generating unit. Conductive wire and ceramic substrates are disposed on the upper end and the lower end of the power generating unit. The power generating unit is formed by P-type and N-type multi-cascade thermoelectric arms that are arranged alternatively. Each multi-cascade thermoelectric arm includes more than two thermoelectric columns that adapt to various temperature conditions and that are sequentially connected through thermal shield layers. The low-temperature end of each multi-cascade thermoelectric arm is connected to the conductive wires through soldering. The high-temperature end of each multi-cascade thermoelectric arm is in mechanical cooperation with the conductive wires through flexible conductive materials. A connecting place of each conductive wire and one corresponding high-temperature end is provided with a groove through milling, flake graphite and an annular cushion are sequentially placed in the groove, and the high-temperature end is disposed in the annular cushion and is in contact with the flake graphite. A mechanical contact method is adopted to achieve thermal conduction, and flexible conductive graphite is adopted to realize positioning and flexible fixing effects, so thermal mismatch stress is eliminated, and materials are prevented from being destroyed. Moreover, all processing machines of the device are low in price, and then the production cost is reduced.

Description

technical field [0001] The invention relates to a multi-cascade thermoelectric device and a manufacturing method thereof, belonging to the field of thermoelectric devices. Background technique [0002] Thermoelectric devices refer to a type of electronic components that can directly realize the mutual conversion of electric energy and thermal energy. Its core is a thermoelectric module composed of multiple groups of thermoelectric materials with different carrier types connected in series and parallel. The overall structure of the thermoelectric module is as follows figure 1 shown. [0003] The application of thermoelectric devices has a history of more than one hundred years. In the early days, they were mainly used to detect temperature, such as thermocouples. Later, with the development of high-performance thermoelectric materials, they were used in electronic temperature control, waste heat power generation and aerospace battery packs and other fields. In the past 20 ...

AI Technical Summary

Problems solved by technology

In addition, the temperature of integrated sintering is also difficult to meet the optimal sintering requirements of two thermoelectric materials in different temperature zones.

In addition, the traditional method is complicated and expensive

Due to the challenges of the sintering process, resulting in low product economic efficiency, low yield and high defects

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