Pressure sensor and method of making the same
A technology of pressure sensor and manufacturing method, which is applied in the direction of measuring fluid pressure, measuring fluid pressure through electromagnetic components, instruments, etc., and can solve problems such as complex structure and complex manufacturing process
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no. 1 Embodiment approach
[0038] A first embodiment of the present application will be described with reference to the drawings. In addition, it is preferable that the pressure sensor of this embodiment is attached to, for example, a fuel pipe of a fuel injection system of a vehicle, and used to detect the pressure of the measurement medium in the fuel pipe.
[0039] like figure 1 As shown, the pressure sensor of this embodiment includes a stem 10 . The stem 10 is formed into a bottomed cylindrical shape having a hollow portion made of stainless steel such as SUS430, a thin-walled diaphragm 11 is formed through the substantially central portion of the bottom, and the other end portion on the opposite side to the diaphragm 11 is formed as Hollow opening 12 . Then, after the measurement medium is introduced from the opening 12 into the hollow portion, the diaphragm 11 deforms according to the pressure of the measurement medium.
[0040] Furthermore, between the diaphragm 11 and the opening 12 in the s...
no. 2 Embodiment approach
[0069] A second embodiment of the present application will be described. In the above-mentioned first embodiment, for figure 2 In the step (c), the example in which the molding resin is injected into the mold to form the mounting portion 44 , the bonding portion 45 , the sealing portion 46 , and the first and second protrusions 47 and 48 has been described. However, when the molding resin is poured into the mold and each of the members 44 to 48 is directly molded, the shape of the mold tends to become complicated, and the manufacturing process tends to become complicated.
[0070] That is, the parts 44 to 48 are formed by injecting molding resin into cavities (spaces) formed in the mold, but the mounting part 44 and the joint part 45 and the sealing part 46 and the first and second protruding parts 47 and 48 are formed. They are separated from each other, and their respective sizes (necessary amount of resin) are different. Therefore, as a mold, it is necessary to appropria...
no. 3 Embodiment approach
[0078] A third embodiment of the present application will be described. In this embodiment, compared with the first embodiment, the internal connection region 41 is directly disposed on the stem 10 , and other aspects are the same as those in the first embodiment, so descriptions thereof are omitted here.
[0079] like Figure 8 As shown in (a), in this embodiment, after the sensor chip 20 is mounted on the diaphragm 11 of the stem 10 , the lead frame 40 is directly arranged on the stem 10 . Specifically, the lead frame 40 is directly disposed on the stem 10 by bonding the other surface 41 b of the internal connection region 41 with an adhesive or the like around a portion of the stem 10 where the sensor chip 20 is disposed.
[0080] also, Figure 8 (a) to Figure 8 (c) represents a section along the lead frame 40, which is the same as image 3 (a) to image 3 (c) Different cross-sectional views, in which the sensor chip 20 is arranged on the stem 10 . Furthermore, the i...
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