Method for printing patterns on inorganic board through heat transfer

A technology of thermal transfer printing and thermal transfer film, which is applied in the process of producing decorative surface effects, decorative art, etc., can solve the problems of applying inorganic plates without thermal transfer printing technology, and achieve shortening of on-site processing time and adhesion Strong, increased weather resistance effect

Active Publication Date: 2015-11-11
南通柯益诺智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is currently no thermal transfer printing technology applied to inorganic plates in the market

Method used

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  • Method for printing patterns on inorganic board through heat transfer
  • Method for printing patterns on inorganic board through heat transfer

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A standard calcium silicate board with a specification of 1220*2440*6mm is used as the base material.

[0031] A method for heat-transfer printing patterns on inorganic plates, the steps are as follows:

[0032] 1) Input the plate into the sanding equipment, use the sanding belt of the sanding equipment to sand the surface of the substrate, and remove the dust on the surface;

[0033] 2) Apply thermal transfer primer on the surface of the dust-removed board, and then level off and dry with infrared rays, so that the primer can be evenly coated and semi-dry. The semi-dry state is that the surface of the paint film is not sticky when touched the state of the hand;

[0034] 3) After hot stamping the thermal transfer film on the surface of the board treated in step 2), peel off the base layer of the thermal transfer film.

[0035] 4) After placing the above-mentioned plates treated in step 3) in a ventilated place for 12-24 hours, use electrostatic dust removal to remove du...

Embodiment 2

[0043] A standard silicate plate with a specification of 1220*2440*6mm is used as the substrate.

[0044] A method for heat-transfer printing patterns on inorganic plates, the steps are as follows:

[0045] 1) Input the plate into the sanding equipment, use the sanding belt of the sanding equipment to sand the surface of the substrate, and remove the dust on the surface;

[0046] 2) Apply thermal transfer primer on the surface of the dust-removed board, and then level off and dry with infrared rays, so that the primer can be evenly coated and semi-dry. The semi-dry state is that the surface of the paint film is not sticky when touched the state of the hand;

[0047] 3) After hot stamping the thermal transfer film on the surface of the board treated in step 2), peel off the base layer of the thermal transfer film.

[0048] 4) After placing the above-mentioned plates treated in step 3) in a ventilated place for 12-24 hours, use electrostatic dust removal to remove dust from th...

Embodiment 3

[0056] The reinforced fiber cement board with a specification of 1220*2440*6mm is used as the base material.

[0057] A method for heat-transfer printing patterns on inorganic plates, the steps are as follows:

[0058] 1) Input the plate into the sanding equipment, use the sanding belt of the sanding equipment to sand the surface of the substrate, and remove the dust on the surface;

[0059] 2) Apply thermal transfer primer on the surface of the dust-removed board, and then level off and dry with infrared rays, so that the primer can be evenly coated and semi-dry. The semi-dry state is that the surface of the paint film is not sticky when touched the state of the hand;

[0060] 3) After hot stamping the thermal transfer film on the surface of the board treated in step 2), peel off the base layer of the thermal transfer film.

[0061] 4) After placing the above-mentioned plates treated in step 3) in a ventilated place for 12-24 hours, use electrostatic dust removal to remove ...

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Abstract

The invention relates to a method for printing patterns on an inorganic board through heat transfer. The method includes the following steps that the board is coated with a heat transfer printing primer after being subjected to sanding and dust removing; then, infrared levelling and drying are conducted, so that uniform and smooth coating of the primer is achieved, and the primer is in a semi-dry state; and after a heat transfer film is thermo-printed on the surface of the treated board, a base layer of the heat transfer film is removed. The method has the beneficial effect that the film heat transfer printing technology and the UV photocuring technology are integrated with the inorganic board. The method can be directly applied to the inorganic board without the need of treating a base material through multiple procedures. In addition, the addition quantity of chemical coatings is reduced. According to the method, the technical procedure is simple and clear, and operation is easy. The method has the advantages that production efficiency is high, the printing technology is exquisite, product losses are small, and adhesive force is high. Investment of manpower and material resources is reduced.

Description

technical field [0001] The invention relates to the technical field of thermal transfer printing, in particular to a method for thermal transfer printing patterns on inorganic plates. Background technique [0002] Due to the wanton exploitation of natural resources by human beings to decorate the living environment, natural resources such as trees and stones are facing depletion. People are also gradually realizing that alternative products should be used in daily life to protect the natural environment. The building materials of inorganic boards are environmentally friendly building materials, but to be used as decorative building materials, it is necessary to make the inorganic boards rich in color through processing. [0003] Inorganic panels with rich decorative effects have the following advantages: 1. It can improve the fire protection level of buildings and have a high safety factor; 2. It is light in weight. As a building wall, it can reduce the weight of buildings;...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B44C1/17B44C1/20
Inventor 瞿冰柳浩寅
Owner 南通柯益诺智能科技有限公司
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