Food packaging film with heat insulation property and high stiffness
A food packaging film, high stiffness technology, used in packaging, household packaging, packaged food and other directions, can solve the problems of heat insulation, poor sealing, damage to packaging film, short shelf life, etc., to achieve excellent light insulation and heat insulation performance , The overall strength is enhanced, and the display is clear.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0026] The heat-insulating high-stiffness food packaging film includes the following composite layers, and the following composite layers are processed into a high-stiffness heat-insulating food packaging film through upper and lower double-roll extrusion, wherein the upper and lower double-roll extrusion The control nip pressure in the lamination area is 100-120kN / m; the temperature of the hot air drying curve in the rear section is 60-80°C, and the moisture in the drying area is controlled to be 9-15% relative to the total mass of the packaging film, and the composite layers of each layer are , see figure 1 :
[0027] (1) The first layer of composite layer 1, choose corona pretreatment, the thickness is 12-18μm PET film, the bottom surface of the PET film is printed with patterns and sizing, the sizing amount is 8-10g / m 2 , the curing amount is 3-5g / m 2 ;
[0028] (2) The second layer of composite layer 2, choose food grade wrapping paper, food grade wrapping paper quanti...
PUM
Property | Measurement | Unit |
---|---|---|
Thickness | aaaaa | aaaaa |
Longitudinal tensile strength | aaaaa | aaaaa |
Smoothness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information

- Generate Ideas
- Intellectual Property
- Life Sciences
- Materials
- Tech Scout
- Unparalleled Data Quality
- Higher Quality Content
- 60% Fewer Hallucinations
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com