A method for evaluating the anti-single event effect ability of sip devices

An anti-single-event effect and single-event-effect technology, applied in instruments, measuring devices, measuring electricity, etc., can solve the problems of inaccurate anti-single-event effect capability of SiP devices, and achieve accurate assessment of anti-single-event effect capability, operable Strong, avoid the effect of repeated experiments

Active Publication Date: 2018-08-07
CHINA ACADEMY OF SPACE TECHNOLOGY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem of the present invention is: in order to overcome the deficiencies of the prior art, a method for evaluating the ability of SiP devices to resist single event effects is proposed, which solves the problem of inaccurate evaluation of the ability of SiP devices to resist single event effects

Method used

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  • A method for evaluating the anti-single event effect ability of sip devices
  • A method for evaluating the anti-single event effect ability of sip devices
  • A method for evaluating the anti-single event effect ability of sip devices

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Embodiment

[0047] Example-Evaluation of SiP Device Anti-Single Event Effect Capability

[0048] 1) Analysis of internal chip anti-single particle capability

[0049]SiP device X, SRAM chip A, Spacewire controller B, multi-protocol controller C, and processor D in the internal chip SiP device have not been tested for single event effects, and there is no single event effect test data, so it is necessary to Before the SiP device is assembled, it is necessary to conduct single event effect tests on the four chips.

[0050] 2) The single event effect test was carried out on the four chips. The test results are shown in Table 1

[0051] Table 1 Single event upset test data of four devices in SIP device X

[0052]

[0053]

[0054] Table 2 Bi ion single event pinning test data of four devices in SIP device X

[0055]

[0056] 3) It can be seen from Table 2 that none of the four chips in the SiP will have a single event lock-in effect, so the single-event lock-in threshold of the a...

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Abstract

The invention discloses a method for evaluating the anti-single event effect capability of a SiP device. The steps are as follows: uncap the SiP; obtain the internal chip information of the SiP, and determine whether the anti-radiation performance of the SiP internal device is recorded in the radiation database; The database has the radiation resistance performance data of the corresponding SIP chip, and all SIP chips can meet the anti-single event index requirements, it is considered that the entire SiP meets the anti-single event index requirements; if a SIP internal chip fails to meet the anti-single event index or radiation There is no corresponding radiation performance test data of a certain SIP chip in the database; determine whether there is a chip in a stacked package in the SiP device; determine whether the upper and lower adjacent chips in the stacked package are the same; , separately packaged into a device; conduct a single event effect test on the chip packaged into a device, the same chip with stacking but the same chip, and the chip without stacking, to obtain test data, and judge whether it meets the anti-single event index. The invention solves the problem of inaccurate evaluation of the anti-single event effect capability of SiP devices.

Description

technical field [0001] The invention relates to a method for evaluating the anti-single event effect capability of a SiP device, belonging to the technical field of single event effect testing. Background technique [0002] SIP devices use system integrated packaging technology to assemble multiple active electronic devices with different functions and optional passive components, as well as other devices such as MEMS or optical devices, into a single standard package that can provide multiple functions. , forming a system or subsystem, and a miniaturized circuit product that can be repaired after a failure. [0003] The existing single particle test methods, such as QJ10005 "Guidelines for Heavy Ion Single Event Test of Aerospace Devices" and ASTM F1192 "Guidelines for the Measurement of Single Event Phenomena of Semiconductor Devices Caused by Heavy Ions", all give the single particle test of monolithic integrated circuits. method, but does not give a single particle test...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/00
Inventor 罗磊魏志超梅博孙毅于庆奎张洪伟
Owner CHINA ACADEMY OF SPACE TECHNOLOGY
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