Unlock instant, AI-driven research and patent intelligence for your innovation.

Method of packaging semiconductor device and apparatus for performing the method

A technology of semiconductors and devices, applied in the field of equipment for implementing the method, capable of solving problems such as low efficiency of heat sinks, low thermal conductivity of flexible substrates, and reduced flexibility of COF semiconductor packaging

Active Publication Date: 2018-04-20
DONGBU HITEK CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, due to the relatively low thermal conductivity of flexible substrates, heat sinks mounted on the bottom surface of flexible substrates can be inefficient
In addition, such heat sinks often have a plate shape by using metal such as aluminum, which may reduce the flexibility of the COF type semiconductor package
Also, over time and in normal use, the heat sink may detach from the flexible substrate

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of packaging semiconductor device and apparatus for performing the method
  • Method of packaging semiconductor device and apparatus for performing the method
  • Method of packaging semiconductor device and apparatus for performing the method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036] Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0037]It will also be understood that when an element or layer is referred to as being "on" another layer, it can be directly on the other layer, film, region or panel, or one or more intervening elements or layers may also be present. On the other hand, it should be understood that when an element is directly disposed on or connected to another element, there cannot be another element in between. In addition, although ordinal numbers such as "first", "second" and "third" are used in various embodiments of the present invention to describe various elements, com...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a method of packaging a semiconductor device mounted on a flexible substrate having a strip shape extending longitudinally and including packaging regions aligned along the extending direction thereof. A blank area on which no semiconductor device is mounted in the packaging area is detected. When the blank area is detected, a heat dissipation coating composition is applied on the semiconductor device mounted on the remaining package area except for the blank area to form a first heat dissipation layer. When the blank area is not detected, the heat dissipation coating composition is applied on the semiconductor device mounted on the package area to form a second heat dissipation layer. Here, the first heat dissipation layer is formed through a potting process, and the second heat dissipation layer is formed through a screen printing process.

Description

technical field [0001] The present invention relates to a method of packaging a semiconductor device and an apparatus for performing the method, and more particularly to a package mounted on a flexible substrate such as a chip-on-film (COF) tape, a tape carrier package (TCP) tape, etc. A method of a semiconductor device, and an apparatus for performing the method. Background technique [0002] In general, a display device such as a liquid crystal display (LCD) may include a liquid crystal panel and a backlight unit disposed on a backside of the liquid crystal panel. A semiconductor device such as a driver integrated circuit (IC) may be used to drive the liquid crystal panel. These semiconductor devices may be connected to the liquid crystal panel using packaging techniques such as COF, TCP, chip on glass (COG), and the like. [0003] High resolution display devices may require increased drive loads to be provided by the semiconductor devices. In the particular case of COF...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48H01L23/373H01L21/67
CPCH01L21/67126H01L24/13H01L24/16H01L24/743H01L24/75H01L24/81H01L24/83H01L24/97H01L2224/13101H01L2224/13144H01L2224/16225H01L2224/32225H01L2224/73204H01L2224/7525H01L2224/81447H01L2224/83855H01L2224/92125H01L23/3121H01L21/563H01L2924/181H01L23/4985H01L23/3737H01L2924/014H01L2924/00014H01L2924/00H01L2924/00012H01L21/48H01L23/373H01L21/67259H01L21/561
Inventor 金俊一金成振金学模
Owner DONGBU HITEK CO LTD