Production control method, device and system of a thin film electronic device

Abstract

The invention discloses production control method, device and system of a thin-film electronic device. The method comprises the following steps of: finishing first etching by using a first mask template and detecting an actual performance parameter of a first circuit pattern after obtaining the first circuit pattern; calculating the difference between the actual performance parameter and a target performance parameter of the thin-film electronic device; determining a correction scheme of the first circuit pattern and a second mask template according to a calculation result; and finishing second etching by using the second mask template according to the correction scheme, and acquiring a corrected second circuit pattern.

Description

technical field [0001] The invention relates to the field of semiconductor production, in particular to a production control method, device and system for thin film electronic devices. Background technique [0002] High-precision thin-film electronic devices need to rely on the thickness of the film to ensure the accuracy of the device's operating characteristics during manufacture. However, common coating equipment can only guarantee a thickness accuracy of -5% to +5% at most. If the device operating characteristic accuracy is higher than the coating thickness control accuracy, the device production yield will be too low, or it will not be able to be produced. [0003] Therefore, the current thin-film electronic devices often use laser to fuse metal or polysilicon after the production is completed, so as to achieve the purpose of correcting the circuit pattern, and then obtain the target operating characteristics of the thin-film electronic device. However, laser equipment...

AI Technical Summary

Problems solved by technology

However, laser equipment is not a conventional equipment for manufacturing thin-film electronic devices, and additional purchase is required, resulting in increased production costs

At the same time, laser fusing can usually only target one point at a time, and the scope of modification is small, which cannot achieve the purpose of modifying large-area circuit patterns, and the efficiency of circuit pattern correction is not high

Moreover, the accuracy of laser fusing is insufficient, and it is impossible to control the high-precision fine-tuning process

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