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semiconductor module

A technology of semiconductor and conductive ground, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electric solid-state devices, etc.

Active Publication Date: 2018-02-02
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Furthermore, due to the use of bonding wires, such semiconductor modules have a high inductance which can lead to undesired overvoltages during operation of the semiconductor module

Method used

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  • semiconductor module
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Embodiment Construction

[0015] figure 1 A circuit diagram of a semiconductor module arrangement with a semiconductor module 10 and an intermediate circuit capacitor module 20 is shown. The semiconductor module 10 includes a half-bridge circuit with at least one first semiconductor chip 1 and at least one second semiconductor chip 2 . In the case of more than one semiconductor chip 1 , a plurality of first semiconductor chips 1 are electrically connected in parallel. Accordingly, in the case of more than one second semiconductor chip 2 , a plurality of second semiconductor chips 2 are electrically connected in parallel. In the example shown, the plurality of first semiconductor chips 1 and the plurality of second semiconductor chips 2 are designed as a plurality of metal-oxide-semiconductor field-effect transistors (MOSFETs). Likewise, the plurality of first semiconductor chips 1 and the plurality of second semiconductor chips 2 can also be configured as a plurality of insulated gate bipolar transis...

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Abstract

The invention relates to a semiconductor module comprising a circuit board, a first semiconductor chip and a second semiconductor chip. Each first semiconductor chip and each second semiconductor chip includes first and second load connections. The circuit board also has a structured first metallization layer comprising the first segment and the second segment and a structured second metallization layer comprising the first segment, the second segment and the third segment. The first segment of the second metallization layer includes a comb-shaped structure with a plurality of first protrusions, and the second segment of the first metallization layer includes a comb-shaped structure with a plurality of second protrusions. The first segment of the second metallization layer and the second segment of the first metallization layer are conductively connected, that is, the circuit board includes a certain number of first via contacts, each first via contact is both on the first protruding Each of the portions is continuously conductively connected to the first segment of the first metallization layer, and each of the second projections is also continuously conductively connected to the second segment of the first metallization layer.

Description

technical field [0001] The invention relates to a semiconductor module. Background technique [0002] In conventional semiconductor modules semiconductor chips are usually used which each have two load connections which are arranged on mutually opposite sides of the semiconductor chip concerned. The semiconductor chip is to be mounted on a carrier body for its electrical wiring. For this purpose, the semiconductor chip is soldered at its load connections to the metallization of the carrier body, while the other of the load connections is connected via one or more bonding wires. And be connected. Furthermore, due to the use of bonding wires, semiconductor modules of this type have a high inductance which can lead to undesired overvoltages during operation of the semiconductor module. Contents of the invention [0003] The object of the present invention is to provide a low-inductance semiconductor module. This object is solved by the semiconductor module according to th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/495H01L23/48
CPCH01L23/49844H01L23/5386H01L23/5389H01L2924/0002H01L25/072H01L2924/00H01L23/4952H01L23/49541H01L23/49575H05K1/185H05K2201/10507
Inventor A·阿伦斯
Owner INFINEON TECH AG