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Preparation method of composite polypropylene series resin sheet

A technology of compounding polypropylene and resin sheets, applied in the directions of printed circuit manufacturing, circuit substrate materials, electrical components, etc., can solve the problems of hindering the lifting of multi-layer boards, weakening the signal shielding function of multi-layer boards, etc., to improve the electromagnetic shielding function. , good for high frequency performance

Inactive Publication Date: 2015-11-25
SUZHOU BOAO PLASTIC ELECTRONICS
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  • Summary
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Problems solved by technology

[0004] However, since the polypropylene film is required to have a lower thickness, the signal interference between the circuit layers will increase, which will weaken the signal shielding function of the multilayer board and hinder the line improvement of the multilayer board.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0023] Embodiment: a kind of preparation method of composite polypropylene resin sheet, carry out according to the following steps:

[0024] Step 1. Prepare two smooth-surfaced carriers, which may be copper foil with a thickness of more than 200 microns;

[0025] Step 2. Prepare carbon fiber cloth pre-impregnated with epoxy resin. The carbon fiber cloth is specifically divided into two types, one is a carbon fiber cloth with a mesh number of 300-400 mesh, and the other is a carbon fiber cloth with a mesh number of 500-600 mesh;

[0026] Step 3, leveling the melted polypropylene resin on the surfaces of the two carriers respectively, and extruding the polypropylene resins on the surfaces of the two carriers into sheet-like polypropylene with pressing rollers to control the thickness of the sheet-like polypropylene 0.7-0.8mil;

[0027] Step 4: First stack a layer of carbon fiber cloth (300-400 mesh) prepared in step 2 on the surface of the sheet-like polypropylene of one of the...

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Abstract

The invention relates to a preparation method of a composite polypropylene series resin sheet. The composite polypropylene series resin sheet is prepared by adopting a mode of clamping a piece of carbon fiber cloth between two layers of flake-like polypropylene and carrying out thermal compression. The bonding strength between the carbon fiber cloth and the flake-like polypropylene is improved by adopting a mode of presoaking the carbon fiber cloth into epoxy resin. The composite polypropylene series resin sheet also has an electromagnetic shielding function when serving as an insulating dielectric or a bonding dielectric between an upper circuit layer and a lower circuit layer traditionally, thereby being capable of improving the electromagnetic shielding function of a multi-layer board, and being conducive to high-frequency performance of the multi-layer board.

Description

technical field [0001] The invention relates to a preparation method of a fat sheet, in particular to a preparation method of a composite polypropylene resin sheet. Background technique [0002] At present, in the manufacture of multilayer circuit boards, the films used for interlayer lamination are generally polypropylene resin sheets (PP films). When manufacturing multi-layer boards with less than four layers, polypropylene film is used as the interlayer bonding medium and insulating medium layer, with stable performance and low manufacturing defect rate. [0003] With the development of science and technology, electronic products are increasingly pursuing lightness, thinness and miniaturization while pursuing complex functions and diversification. This requires circuit boards to use high-density circuit configuration and micro-hole technology to achieve the goal. Multi-layer circuit boards Design becomes necessary. For some complex electronic devices, the multilayer desi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K1/03
CPCH05K3/0011H05K1/0366H05K2201/0158H05K2201/029
Inventor 丁铭冯照泰张友明
Owner SUZHOU BOAO PLASTIC ELECTRONICS
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