Silicon-wafer transport trolley

Abstract

The invention discloses a silicon-wafer transport trolley, and belongs to the technical field of solar-cell production. The silicon-wafer transport trolley comprises a trolley frame and a plurality of layers of partition plates which are arranged on the trolley frame and used for allowing silicon wafers to be placed, wherein rolling wheels are arranged at the bottom of the trolley frame. The silicon-wafer transport trolley is characterized in that the partition plates comprise a bottom plate positioned at the bottom, and a plurality of upper partition plates positioned above the bottom plate; each upper partition plate comprises a plurality of folding plates which can be overlapped and unfolded mutually; the height of the bottom end of each of the folded folding plates is higher than that of the upper end of a silicon-wafer box; two ends of each upper partition plate are connected with the trolley frame in a sliding manner; the inner side of each upper partition plate is hinged to the trolley frame. Through the adoption of the silicon-wafer transport trolley disclosed by the invention, the silicon-wafer box is convenient to fetch and place, and the phenomenon that because silicon wafers are collided during moving, the silicon wafers are damaged is avoided; besides, the transportation volume of a unit transport machine is increased, and the transport efficiency is improved.

Description

technical field [0001] The invention relates to a transportation tool for materials, in particular to a transportation tool for silicon wafers, which is used for short-distance transportation and transfer of sliced ​​silicon wafers. Background technique [0002] At present, single-polycrystalline silicon wafers need to be cleaned after being cut into slices from crystal ingots. After cleaning, the single wafers are separated and placed side by side in silicon wafer boxes. The average thickness of single and polycrystalline silicon wafers is 180um, which is equivalent to the thickness of a hair, and is fragile. During the production and transportation of silicon wafers, 25 pieces of silicon wafers are temporarily placed in each cassette. Although there is a protection of the cassette, if it is bumped or tilted during placement, it will damage the silicon wafers in the cassette and cause the wafers to break. . Therefore, the movement and transportation of silicon wafers has ...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the technical problems of inconvenient taking and placing of the silicon wafer box in the prior art and is easy to be bumped, and provides a silicon wafer transportation tool which is convenient for taking and placing and can effectively protect the silicon wafer

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