Base-band chip heat-dispersion structure and mobile terminal

Abstract

The invention discloses a base-band chip heat-dispersion structure which comprises a circuit board, a base-band chip and a thermal conductive heat pipe, wherein the base-band chip and the heat pipe are respectively arranged on the two opposite surfaces of the circuit board, the heat pipe is attached and fixed to the circuit board, the heat pipe has a heat absorption end facing the base-band chip, the base-band chip and the heat pipe are respectively arranged on two opposite surfaces of the circuit board, and the heat absorption end of the heat pipe faces the base-band chip. Heat of the base-band chip can be directly conducted to the heat absorption end of the heat pipe. The thermal resistance is relatively low, heat transfer efficiency is high, and the heat-dispersion performance is improved. The heat pipe is fixed on the circuit board and integrated with the circuit board to install and position the heat pipe, and a groove for installing and positioning the heat pipe does not have to be arranged in other structures, such as a middle frame, of the mobile terminal. The strength of other structural member of the mobile terminal may not be affected. The invention further discloses a mobile terminal employing the base-band chip heat-dispersion structure.

Description

technical field [0001] The invention relates to portable electronic products, in particular to a baseband chip heat dissipation structure and a mobile terminal. Background technique [0002] In the existing hand-held mobile terminal equipment, on the one hand, the heat dissipation of the baseband chip is carried out through the surface of the chip, and the heat of the baseband chip needs to pass through plastic packaging materials, heat-conducting silica gel, shielding covers, graphite and other media before reaching the heat-conducting material. The resistance is large, so the heat conduction efficiency is low. On the other hand, the heat pipes used to dissipate heat from the baseband chips in the prior art usually place grooves in the middle frame of the structure to place the heat pipes, so as to realize the positioning of the heat pipes, which will lose the mechanical strength of the middle frame. Contents of the invention [0003] The technical problem to be solved b...

AI Technical Summary

Problems solved by technology

[0002] In the existing hand-held mobile terminal equipment, on the one hand, the heat dissipation of the baseband chip is carried out through the surface of the chip, and the heat of the baseband chip needs to pass through plastic packaging materials, heat-conducting silica gel, shielding covers, graphite and other media before reaching the heat-conducting material. The resistance is very large, so the thermal conductivity is low

On the other hand, the heat pipes used to dissipate heat from the baseband chips in the prior art usually place heat pipes by digging grooves on the middle frame of the structure to realize the positioning of the heat pipes, which will lose the mechanical strength of the middle frame

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