Making method of circuit board

Abstract

The invention discloses a making method ofa circuit board. The making method comprises steps of forming a conductive circuit on a copper foil in a physical way and transferring the conductive circuit to one side, on which insulation adhesive materials are arranged, of the base plate; and laminating the copper foil of the conductive circuit on the base plate on which the insulation materials are arranged, thereby forming a circuit board. In this way, the process for making the circuit board is simplified; cost is reduced; and thicker copper foils can be processed with the method.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a circuit board. Background technique [0002] In the current widely used circuit board technology, a large number of chemical agents are used for surface treatment, the copper foil is pressed on the substrate, and a lead-tin corrosion layer is plated on the surface of the copper foil that needs to be retained as a conductive line, and then chemically Etch the rest of the copper foil; or laminate a dry film or wet film on the substrate laminated with copper foil, and then form a conductive circuit covered with copper through exposure, development, etching and other processes. However, this chemical treatment method is complicated in process, high in production cost, and pollutes the surrounding environment to a certain extent. At the same time, the existing method of forming conductive lines by etching has certain restrictions on the thickness o...

AI Technical Summary

Problems solved by technology

However, this chemical treatment method is complex in process, high in production cost, and pollutes the surrounding environment to a certain extent.

At the same time, the existing method of forming conductive lines by etching has certain restrictions on the thickness of copper foil. When the copper foil is thick, the etching effect is not ideal.

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