A circuit board and display device

Abstract

A circuit board and a display device are disclosed. The circuit board is configured to be bonded onto a display substrate; the circuit board includes a bonding connection end, which includes a base film and a plurality of first connecting terminals disposed on the base film; regions, which are corresponding to at least part of the first connecting terminals, of the base film comprises a transparent membrane material. The circuit board improves the product quality monitoring level during the bonding process, and decreases the product risks.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a circuit board and a display device. Background technique [0002] In the field of display technology, a bonding process is usually used, such as bonding the peripheral circuit board FPC to a display substrate (such as an array substrate or a color filter substrate). [0003] The binding process is affected by temperature, pressure and time, resulting in quality differences. These influencing factors of the binding process will change during the product manufacturing process due to equipment stability and material accuracy, which will cause product quality fluctuations, so we need to ensure product quality through monitoring. [0004] At present, the COG (Chip On Glass) between the chip and the display substrate and the FOG (FPC On Glass) between the peripheral circuit board and the display substrate are all bound to the array substrate TFT Glass. Since the array subst...

AI Technical Summary

Problems solved by technology

The area of ​​the black matrix 13 is opaque, and the binding state of the binding end 31 of the peripheral circuit board 3 cannot be observed under a microscope

[0006] In order to monitor the binding status of the peripheral circuit boards on the color filter substrate, reduce product risks, and improve product quality, the current implementation methods are (1). Firstly, the color filter substrate and the array substrate completed by the box are separated, and then the black matrix is ​​removed. , and then use a microscope to observe, so the monitoring of the binding state has the following disadvantages: 1) high cost; 2) dismantling takes a long time, and the monitoring frequency is seriously insufficient; 3) the safety factor is low

(2). Tear off the peripheral circuit boards that have been bonded and connected, and then use a microscope to observe. The disadvantages of this monitoring method are: 1) High cost; 2) It can only monitor the deformation state of gold ball particles, but cannot monitor the bonded state. Whether there are air bubbles in the glue and whether the corresponding binding terminals are coincident

(3). Open a window on the black matrix film layer of the color filter substrate. After the window is opened, the window can transmit light, and the binding state can be directly observed under a microscope. However, the disadvantages are: 1) The window will cause frictional shadows ( That is, when rubbing to form an alignment film, since a depression is formed on the film layer at the window opening, friction shadows are prone to appear when rubbing to form an alignment film); 2) The window opening will cause light leakage of the product

Images