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Pin-column type mini-size radiator having end face with phyllotaxy structure

A heat sink and end face technology, applied in the field of micro heat sinks, can solve the problems of reduced heat dissipation space and inability to use heat dissipation methods

Inactive Publication Date: 2015-12-16
SHENYANG LIGONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These are currently unable to meet the needs of stable operation of electronic components, especially with the reduction of the internal heat dissipation space of components or electronic equipment, it is no longer possible to use conventional heat dissipation methods, and the structure of the radiator must be changed to improve the performance of electronic components. cooling capacity

Method used

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  • Pin-column type mini-size radiator having end face with phyllotaxy structure
  • Pin-column type mini-size radiator having end face with phyllotaxy structure
  • Pin-column type mini-size radiator having end face with phyllotaxy structure

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Embodiment Construction

[0022] A needle-column micro-radiator with a phyllotaxy arrangement structure on the end face, comprising a heat-dissipating bottom plate 12 and a plurality of heat-dissipating columns 13 .

[0023] A plurality of heat dissipation columns 13 are integrally arranged on the working end surface of the heat dissipation bottom plate 12 , and all the plurality of heat dissipation columns 13 are perpendicular to the working end surface of the heat dissipation bottom plate 12 .

[0024] 1) According to the requirements of the object to be radiated, use CAD software to design image 3 The heat dissipation bottom plate 12 in the heat dissipation bottom plate 12, the thickness of the heat dissipation bottom plate 12 is selected at 1 mm to 3 mm, and its center position is determined. The length and width of the heat dissipation bottom plate 12 are determined by the size of the object to be radiated.

[0025] 2) According to figure 1 and figure 2 The phyllotaxy structure arrangement of...

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Abstract

The invention provides a pin-column typemini-size radiator having an end face with a phyllotaxy structure. The invention belongs to the technical field of mini-size raditors used for heat dissipation of electronic components and relates to the design of distribution structure of radiating columns of the radiator with the phyllotaxy structure. The radiator includes a radiation bottom board and the multiple radiation columns arranged on a working end face of the radiation bottom board. The distribution of the radiation of the mini-size radiator meets an H. Vogel model employing a phyllotaxy theory in biological science. Since the radiation columns are in distribution meeting the H. Vogel model law on the surface of the bottom board of the radiator, geometric position compensation and maximum filling effect are realized by the radiation columns on the working surface of the mini-size radiator.

Description

technical field [0001] The invention belongs to the technical field of miniature radiators, in particular to a needle-column miniature radiator with a phyllotaxy arrangement structure on the end face, and is a novel bionic structure miniature radiator. The biggest difference between this micro-radiator and other micro-radiators is that the arrangement structure of heat dissipation columns (or pin columns) presents a phyllosequential arrangement on the end surface of the radiator base. The miniature heat sink is mainly used in the heat dissipation process of microelectronic components, semiconductor components and other micro components, which can effectively reduce the surface temperature of components, improve the service life and work efficiency of components, and play an important role in the development of electronic components. has important meaning. Background technique [0002] With the continuous improvement of the integration and performance of electronic component...

Claims

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Application Information

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IPC IPC(8): H01L23/367
CPCH01L23/3675F28F3/022
Inventor 吕玉山王军舒启林胡玉珩
Owner SHENYANG LIGONG UNIV
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