Active tag module and manufacturing method thereof

Abstract

The invention provides an active tag module and a manufacturing method thereof. The active tag module comprises a circuit board, an outer frame, electronic components and a black adhesive layer, wherein the outer frame is connected with the upper surface of the circuit board, a through hole is formed in the outer frame, the electronic components are arranged inside the through hole and welded on the circuit board, the black adhesive layer fills in the through hole and arranged above the electronic components, and a plurality of pins to be connected externally are formed on the circuit board. The active tag module can be used for packaging a chip and peripheral circuits of an active tag through the circuit board, the outer frame and the black adhesive layer, when in use, the user can connect the whole active tag module to an application circuit in a patching manner by utilizing the pins to be connected externally on the circuit board without caring about the specific internal structure of the active tag module, thereby the design of hardware circuits is greatly simplified, the reliability of circuits is improved, and the active tag module has the advantages of simple structure and low cost.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to an active label module and a manufacturing method thereof. Background technique [0002] In the prior art, the corresponding pins can only be made by binding the wafer on the substrate of the IC. In this way, in the hardware design process, it is also necessary to check the peripheral circuits (such as capacitors, resistors, etc.) on the circuit board. The layout brings great inconvenience to the hardware design, reduces the work efficiency, and also affects the reliability of the circuit. Contents of the invention [0003] The invention provides an active label module with simple structure, low cost, high integration, improved work efficiency and circuit reliability and a manufacturing method thereof. [0004] In order to solve the above problems, as an aspect of the present invention, an active label module is provided, including a circuit board, an outer frame, electronic comp...

AI Technical Summary

Problems solved by technology

[0002] In the prior art, the corresponding pins can only be made by binding the wafer on the substrate of the IC. In this way, in the hardware design process, it is also necessary to check the peripheral circuits (such as capacitors, resistors, etc.) on the circuit board. The layout brings great inconvenience to the hardware design, reduces the work efficiency, and also affects the reliability of the circuit

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