Sealing technique for element of PCM board
A board component and process technology, which is applied in the field of PCM board component sealing technology, can solve the problems of difficult control of PCM board quality, influence on production efficiency, and long production time, and achieve the goals of shortening production time, improving product quality, and improving production efficiency Effect
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[0015] In order to allow those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described below in conjunction with the examples.
[0016] A kind of PCM board element sealing process, comprises the steps:
[0017] S1 Put the low-temperature glue into the glue tank of the glue melting machine to dissolve; when dissolving, control the melted low-temperature glue in the glue melter to any value between 150 and 210°C to achieve complete low-temperature glue It melts to facilitate the combination of low-temperature glue and PCM board in the next step.
[0018] S2 Put the PCM board welded with components into the jig; the jig used is composed of an upper jig and a lower jig. By controlling the opening and closing between the upper jig and the lower jig, the PCM board can be Put into the jig or take it out of the jig. The upper jig and the lower jig are matched, and after the upper jig and the lower jig a...
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