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A kind of preparation method of ultrafine copper powder for chip multilayer ceramic capacitor

A technology of ultra-fine copper powder and multi-layer ceramics, applied in the field of copper powder for multi-layer ceramic capacitors, can solve the problems of uneven particle size, irregular shape, easy oxidation, etc., and achieve narrow particle size distribution and uniform particle size. Controllable, non-oxidizing effect

Active Publication Date: 2017-08-25
JINCHUAN GROUP LIMITED
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The copper powders prepared by the methods currently used all have shortcomings such as uneven particle size, easy agglomeration, irregular shape, and easy oxidation to varying degrees.

Method used

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  • A kind of preparation method of ultrafine copper powder for chip multilayer ceramic capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Prepare 102g / L sodium carbonate solution and copper sulfate solution containing 57g / L copper, measure 200mL pure water as the bottom solution, add 0.2g polyethylene glycol, heat the bottom solution to about 50℃, measure 200mL sulfuric acid respectively Copper solution and 350mL sodium carbonate solution are slowly added dropwise into the bottom solution and stirred for reaction. The pH value of the mixed solution is maintained at 8-9, and the rotation speed is 400r / min. After the copper sulfate solution and sodium carbonate solution are added dropwise, the holding time is 1-2h. The temperature is 50-70°C, and the ultra-fine copper powder precursor is prepared. The average particle size of the ultra-fine copper powder precursor is 3.5 μm; the prepared ultra-fine copper powder precursor is washed three times with pure water, and after washing, use 2% BaCl 2 The solution was measured, and there was no white precipitate to prove that the washing was clean; after washing, th...

Embodiment 2

[0024] Prepare 104.3g / L sodium carbonate solution and copper sulfate solution containing 59.2g / L copper, measure 200mL pure water as the bottom solution, add 0.4g polyethylene glycol, heat the bottom solution to about 50°C, measure 400mL of copper sulfate solution and 700mL of sodium carbonate solution were slowly added dropwise into the bottom liquid and stirred for reaction. The pH value of the mixed solution was maintained at 8-9, and the rotation speed was 500r / min. After the copper sulfate solution and sodium carbonate solution were added dropwise, the holding time was 1~ 2h, the temperature is 50 ~ 70 ℃, prepare the ultrafine copper powder precursor, the average particle size of the ultrafine copper powder precursor is 3.4μm; wash the prepared ultrafine copper powder precursor three times with pure water, wash with 2 %BaCl 2 The solution was measured, and no white precipitate proved to be clean; after washing, the ultrafine copper powder precursor was slurried, and 300mL...

Embodiment 3

[0026] Prepare 106g / L sodium carbonate solution and copper sulfate solution containing 62g / L copper, measure 200mL pure water as the bottom solution, add 1.0g polyethylene glycol, heat the bottom solution to about 50℃, measure 2000mL sulfuric acid respectively Copper solution and 4000mL sodium carbonate solution are slowly added dropwise into the bottom solution and stirred for reaction. The pH value of the mixed solution is maintained at 8-9, and the rotation speed is 600r / min. After the copper sulfate solution and sodium carbonate solution are added dropwise, the holding time is 1-2h. The temperature is 50-70°C, and the ultra-fine copper powder precursor is prepared. The average particle size of the ultra-fine copper powder precursor is 4.2 μm; the prepared ultra-fine copper powder precursor is washed three times with pure water, and after washing, use 2% BaCl 2 The solution was tested, and no white precipitate proved to be clean; after washing, the ultrafine copper powder p...

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Abstract

The invention discloses a method for preparing ultrafine copper powder for chip multilayer ceramic capacitors, belongs to the technical field of functional powder materials, and relates to a method for preparing ultrafine copper powder by a liquid phase reduction method and surface modification thereof. The process of the present invention adopts the process of firstly mixing copper sulfate solution and sodium carbonate solution to prepare the ultrafine copper powder precursor, and then adding hydrazine hydrate to reduce the ultrafine copper powder precursor, which not only reduces the raw material price of the ultrafine copper powder precursor Inexpensive, and the prepared superfine copper powder precursor is stable, not easy to oxidize, and the residual SO42‑ is easy to clean; at the same time, the prepared superfine copper powder has high purity, spherical shape, narrow particle size distribution and uniform particle size Controllable, good dispersibility and excellent electrical conductivity; the method of the invention has simple technological process, mild reaction, simple and convenient operation, and is easy to realize large-scale production.

Description

technical field [0001] The invention relates to copper powder for multilayer ceramic capacitors, in particular to a method for preparing ultrafine copper powder for chip multilayer ceramic capacitors. Background technique [0002] At present, the manufacturers of base metal chip multilayer ceramic capacitors are mainly concentrated in Japan. Because the production technology of high-quality ultrafine copper powder and ultrafine nickel powder for chip multilayer ceramic capacitors is controlled by a few manufacturers in Japan, my country The copper powder and nickel powder produced are difficult to meet the requirements of chip multilayer ceramic capacitors in terms of uniformity of particle size distribution and oxidation resistance. The copper powder and nickel powder required for the production of chip multilayer ceramic capacitors mainly rely on imports , making the development of my country's base metal chip multilayer ceramic capacitor technology has been greatly restrict...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/24
Inventor 杨志强李娟张新涛马海青张科翠欧晓健张鹏樊昱张娟高晓婷马天飞
Owner JINCHUAN GROUP LIMITED