Cooling device of computer mainframe box

Abstract

The invention discloses a cooling device of a computer mainframe box. The cooling device of a computer mainframe box comprises a circuit board, the rear portion of the circuit board is fixedly connected to a mainframe case, the front portion of the circuit board is fixedly provided with cooling fins, the outside of the cooling fins is fixedly provided with a heat absorbing tube, the intermediate portion of the heat absorbing pipe is provided with a temperature sensor, and the left end of the heat absorbing pipe penetrates the mainframe case and movably connected to a cooling device via a joint. The cooling device comprises a housing, the upper portion of a housing chamber is fixedly provided with a pure water tank, a water feeding cover is fixedly mounted on the pure water tank, the bottom of the pure water tank is fixedly connected to a cooling pipe, the lower end of the cooling tube penetrates a control box and fixedly connected to a water pump, the upper end of the water pump is fixedly connected to the joint, a controller is fixedly mounted in a chamber in the left side of the control box, and the outside of the cooling device is fixedly connected to a USB line. The cooling device of a computer mainframe box is simple in structure, convenient, practical, good in cooling effect and has a good popularization market.

Description

Technical field [0001] The invention relates to the technical field of computer heat dissipation, in particular to a heat dissipation device for a computer main box. Background technique [0002] At present, the use of computers is gradually popularized, being used in all walks of life, and has become a necessary office equipment. The daily use time is very long, but after the computer is used for a period of time, the components inside the chassis will dissipate heat. , So that the temperature inside the case increases, thereby affecting the computer's operating speed. In the existing technology, most computer heat dissipation uses vents on the chassis, through the automatic exchange of heat inside and outside, to achieve the purpose of heat dissipation, the heat dissipation effect is not good, so that the temperature in the computer chassis is in a high temperature state for a long time, affecting the computer normal operation. Summary of the invention [0003] The purpose of ...

AI Technical Summary

Problems solved by technology

[0002] At present, the use of computers is gradually popularized, used in all walks of life, and has become a necessary equipment for office. The daily use time is very long, but after the computer is used for a period of time, the components inside the chassis will dissipate heat. , making the temperature inside the chassis rise, thus affecting the running speed of the computer

In the existing technology, computer heat dissipation mostly adopts heat dissipation holes on the chassis, through the automatic exchange of heat inside and outside, to achieve the purpose of heat dissipation, the heat dissipation effect is not good, so that the temperature in the computer chassis is in a high temperature state for a long time, affecting the performance of the computer normal operation

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