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A method for manufacturing a circuit board with metallized back-drilled holes

A production method and back-drilling technology, which is applied in the manufacture of printed circuits, printed circuits, and the formation of electrical connections of printed components, etc., can solve problems such as poor tin plating coverage, scrapping, and no copper, so as to improve the quality of electroplating and ensure product quality , cost-saving effect

Active Publication Date: 2018-04-24
SHENZHEN SUNTAK MULTILAYER PCB
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above method is suitable for the production of back-drilled holes with a depth-to-aperture ratio of ≤1:1, but for back-drilled holes with a depth-to-aperture ratio of ≥1:1, it will be difficult to exchange the copper plating solution in the hole during metallization. The copper at the bottom of the back-drilled hole is thin, or the tin-plating solution is difficult to exchange in the hole, resulting in poor tin-plating coverage and exposed copper, resulting in no copper in the hole after etching and scrapping

Method used

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Experimental program
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Embodiment

[0020] PCB parameter requirements

[0021] Inner core board: 0.076mm 1 / 1OZ (without copper) (1 piece);

[0022] Number of layers: 4 layers;

[0023] Outer line width / spacing: 0.40 / 0.40mm (finished copper thickness 1.0OZ);

[0024] Inner layer line width / line spacing: 0.35 / 0.15mm (finished copper thickness 1.0OZ);

[0025] Sheet Tg: ≥170°;

[0026] Outer copper foil: H / HOZ;

[0027] Hole copper thickness: 18μm(min) / 20μm(ave);

[0028] Surface treatment: immersion gold;

[0029] Finished board thickness: 1.55mm±10%;

[0030] Min drill bit: 1.10mm;

[0031] Drilling depth: 1.2±0.15

[0032] Drilling thickness to diameter ratio: 1:1.09;

[0033] Production PNL size: 462mm×614mm.

[0034] PCB manufacturing process of the present invention

[0035] 1. Cutting process - according to the number of required core boards and the PNL size of the production board 462mm*614mm, the standard board is cut into the size of the production board to facilitate production and operation. ...

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Abstract

The invention discloses a manufacturing method for a circuit board with a metallization back drilled hole. The method includes the steps that S1, a circuit board with a back drilled hole is coated with a dry film, and a needed copper circuit and the needed back drilled hole are exposed after exposure and development, wherein the surface of the circuit board is coated with a copper layer; S2, the interior of the back drilled hole and the exposed copper circuit are plated with copper till a needed copper layer thickness is achieved, and are then plated with tin till a needed tin layer thickness is achieved; S3, the dry film on the surface of the circuit board is removed, and surface layer copper in the dry film zone is exposed; S4, the opening of the back drilled hole is covered with an anti-etching film; S5, the surface layer copper, corresponding to the dry film zone, on the surface of the circuit board is etched off; S6, the anti-etching film covering the opening of the back drilled hole is removed; S7, a tin layer in the back drilled hole of the circuit board and a tin layer on the surface of the exposed copper circuit of the circuit board are removed. According to the manufacturing method for the circuit board, by adding the process of covering the back drilled hole of the circuit board, electroplating quality can be effectively improved, meanwhile, the problem of poor tin plating caused by aging of a tin plating agent and reduction of depth capacity is solved, influences of aging of a tin plating agent on depth capacity in electroplating are effectively improved, and cost is lowered.

Description

technical field [0001] The invention belongs to the technical field of circuit board production, in particular to a method for manufacturing a circuit board with metallized back-drilled holes. Background technique [0002] For the functional requirements of circuit board installation and fixing pins, it is necessary to make back-drilled holes on the circuit board product (only drill a certain depth of hole from one side of the board to the inside of the board). The existing back-drilling holes are first drilled with ordinary drills and then drilled with flat drills, and then metallized. The diameter and depth of the back-drilled holes on the circuit board have requirements (customer-specified tolerance requirements), mainly including external layer graphics to expose the required circuit graphics and back drilling; graphic electroplating performs copper plating and tin plating on the exposed circuit graphics and back drilling (special control of copper plating and tin platin...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/42
CPCH05K3/0094H05K3/42
Inventor 陈洪胜刘克敢韩焱林
Owner SHENZHEN SUNTAK MULTILAYER PCB
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