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Electrolytic grinding and milling composite processing cathode grinding head device

A composite machining and cathode technology, which is applied in the fields of electrolytic machining and grinding machining, can solve the problems of poor machining quality and low machining efficiency, and achieve the effects of reducing machining cost, simple manufacturing process and weakening polarization phenomenon.

Active Publication Date: 2018-06-05
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In order to improve the situation of poor processing quality and low processing efficiency caused by the uneven distribution of the gap flow field in the existing electrolytic grinding and milling process, a composite electrolytic grinding and milling compound that can improve the gap flow field distribution in the electrolytic grinding and milling process and improve the processing efficiency and processing quality is proposed. Processing cathode grinding head device

Method used

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  • Electrolytic grinding and milling composite processing cathode grinding head device
  • Electrolytic grinding and milling composite processing cathode grinding head device
  • Electrolytic grinding and milling composite processing cathode grinding head device

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Embodiment

[0034] The embodiment of the present invention is aimed at the removal of GH4169 cutting depth 3mm lateral material.

[0035] In step 1, the cathode body is selected as a rod with a diameter of 6 mm and a length of 70 mm.

[0036] In step 2, a central blind hole with a diameter of 4mm and a depth of 69mm is machined in the center of the cathode body, and the end is rounded by 0.5mm.

[0037] Step 3, due to the large depth of cut and large flow demand, take the radius r of the liquid hole 0 0.75mm, the radius of action r is 1mm, the layer distance d is 1mm, and the hole spacing l is 3mm. Divide the circumference by the distance between the holes, 6 liquid holes are evenly distributed on each layer, and each layer is staggered by 20°, a total of 3 layers, each layer is 1mm apart, and the bottom layer is 1mm from the bottom surface.

[0038] Step 4, electroplating the diamond abrasive grain layer, the diamond grain size is 150#.

[0039] Step 5, after confirming that the liqui...

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Abstract

The invention relates to a cathode grinding head device for electrolysis grinding and milling combined machining, and belongs to the field of electrolysis machining and grinding machining. The cathode grinding head device comprises a cathode body (1) which is provided with a central blind hole (3). Abrasive particle layers (4) are arranged on the outer surface of the lower portion and the bottom face of the cathode body (1). The cathode body (1) is further provided with liquid introducing holes (2) communicated with the central blind hole (3). The radius r0 of the liquid introducing holes (2) ranges from 0.25 mm to 0.75mm, the effective electrolysis action radius r of the liquid introducing holes (2) in the size is equal to (1-1.5)*r0, and the central distance 1 of any adjacent liquid introducing holes (2) in the same layer or the same concentric circle ranges from 3r to 5r. By means of the cathode grinding head device, gap flow field distribution of electrolysis grinding and milling combined machining can be improved, and the machining efficiency and the machining quality are improved.

Description

technical field [0001] The invention belongs to the field of electrolytic processing and grinding, and specifically relates to a cathode grinding head device for electrolytic grinding and milling composite processing. Background technique [0002] With the continuous development of science and technology, there are more and more applications of difficult-to-machine conductive materials such as high-temperature alloys and cemented carbides. However, due to their superior physical and chemical properties, the processing of these materials has become extremely difficult. Traditional machining methods have disadvantages such as fast tool wear, long machining cycle, micro-cracks on the surface, and difficulty in machining thin-walled and other special structures due to high cutting force. Therefore, special machining in the field of high-performance conductive material processing has become more and more important. [0003] At present, the processing methods used for difficult-t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23H5/08B23H5/10
CPCB23H5/08B23H5/10
Inventor 李寒松张庆良汪浩牛屾曲宁松
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS