Water sprayer for silicon wafer cutting machine

Abstract

The invention relates to a water sprayer for a silicon wafer cutting machine. By the adoption of the water sprayer for the silicon wafer cutting machine, the defect that in the prior art, a water spraying pipe in a water spraying device for the silicon wafer cutting machine cannot be matched with a flow guiding frame conveniently is overcome. According to the water sprayer for the silicon wafer cutting machine, a water spraying pipe is fixed to a supporting plate, a filter body is arranged in the water spraying pipe, a filter cover is also arranged on the water spraying pipe, water entering a cutting field through the flow guiding frame is filtered twice, and thus the water quality is optimized; in addition, a cover body is arranged on a supporting plate, the water spraying pipe is surrounded through the cooperation of the cover body and the flow guiding frame, and both the flow guiding frame and the cover body have the guiding effect during water spraying of the water spraying pipe, so that water flow sprayed out of a water spraying tank is guided to the cutting field; due to the existence of the cover body, the water spraying direction of the water spraying tank both can face the flow guiding frame and can face the cover body; in this way, the water spraying direction of the water spraying tank does not need to be considered when the water spraying pipe and the supporting plate are assembled, and the operation of assembling the water spraying pipe and the supporting plate is convenient.

Description

technical field [0001] The invention relates to a silicon chip cutting machine accessory, in particular to a water sprayer for a silicon chip cutting machine. Background technique [0002] The production of silicon wafers used to be cut by steel wire-loaded mortar before, but now it is directly cut by a special gold-steel wire with water. This technology not only greatly shortens the production and processing time, but also improves the overall quality of the product. Production costs have also dropped significantly. The diamond wire cutting technology also has high requirements for water quality, not only requires pure water and additives, but also requires no solid small particles in the water. If there is a lot of solid debris in the water, the wire mesh will easily bring the debris to the main roller during cutting, which will cause skipping and lead to a high probability of wire breakage, and the solid debris will adhere to the seam of the silicon rod so that the water...

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a water sprayer for a silicon wafer cutting machine, which aims to overcome that the water spray pipe in the water spray device for a silicon wafer cutting machine in the prior art has no filtering performance, and the assembly operation of the water spray pipe and the drainage frame is inconvenient lack of

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