Fixing device used for silicon ingot grinding and cutting

Abstract

The invention discloses a fixing device used for silicon ingot grinding and cutting. The fixing device comprises a crystal support. A plurality of baffles are evenly arranged on the circumferential edge of the crystal support. The height H1 of the baffles is larger than or equal to the height H2 of a silicon ingot. A winding film wraps the peripheries of the baffles to form a cutting fluid storage space with the crystal support as the bottom and the winding film as the wall. A simple cutting fluid soaking tank is formed by the crystal support, the baffles and the winding film. In the working process, surrounding sand blasting nozzles are closed so that all the cutting fluid can be sprayed to the surface of the silicon ingot through a middle sand blasting nozzle in a concentrated manner, the cutting fluid is then stored by the soaking tank, the silicon ingot is soaked in the cutting fluid, the cutting fluid on the surface of the silicon ingot is uniformly distributed, the cutting speed is easily increased, the problem of ground and cut crystal ingot size deviation caused by insufficient cutting fluid can be remarkably solved, the accuracy of the ground and cut silicon ingot is improved, and the fixing device has the beneficial effects of being simple in structure and low in cost and is convenient to operate.

Description

technical field [0001] The invention relates to a fixing device, in particular to a fixing device for squaring silicon ingots, and belongs to the field of solar photovoltaic silicon ingot processing. Background technique [0002] Polycrystalline silicon wafers for polycrystalline solar cells need to be cast into ingots, squared ingots, and sliced ​​into crystal bricks. Generally, silicon ingots are prepared by fixing the silicon ingots on the crystal support, using steel wires as the carrier, and carrying silicon carbide cutting mortar to grind and cut back and forth. During the cutting process, the silicon carbide cutting fluid is sprayed from the middle and surrounding sandblasting nozzles, the middle sandblasting nozzle sprays the cutting fluid onto the surface of the silicon ingot, and the surrounding sandblasting nozzles spray the cutting fluid onto the steel wire. In this process, when the mortar is sprayed on the surface of the silicon ingot, it is easy to cause unev...

AI Technical Summary

Problems solved by technology

In this process, when the mortar is sprayed on the surface of the silicon ingot, it is easy to cause unevenness, which leads to the slow cutting speed of the steel wire and the abnormal size deviation of the crystal brick, which reduces the accuracy of the square of the silicon ingot. Therefore, the subsequent cutting of the silicon wafer precision

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