Chip packaging equipment for 12-inch wafers

Abstract

The invention discloses chip packaging equipment suitable for a 12inch wafer. The chip packaging equipment comprises a slide mounting rack and a loading welding head, wherein the slide mounting rack is driven by a first drive unit to slide back and forth along a horizontal direction; the loading welding head is arranged on an output shaft of a second drive unit; a third drive unit is arranged on the loading welding head and drives the loading welding head to rotate at 360 degrees; the second drive unit is also fixedly arranged on the slide mounting rack; and meanwhile, a wafer supporting stage is driven by a fourth drive unit to rotate at 180 degrees. Compared with the prior art, the length of the loading welding head does not need to improve, so that the loading accuracy and speed of the loading welding head are not affected; and the welding head can carry out reciprocating drive between an unloading position and a loading position within the shortest possible time. Meanwhile, the power consumption and the service lifetime of the loading welding head are not affected; and a loading operation on the 12inch wafer can be finished under the premise of not changing the structure of the loading welding head.

Description

Technical field [0001] The invention relates to the field of semiconductor packaging equipment, in particular to a chip packaging equipment suitable for 12-inch wafers. Background technique [0002] In the current chip packaging equipment, the chip mounting and bonding head mechanism usually controls its rotation through a motor to complete the process of crystal fetching and chip mounting. With the advancement of technology and the upgrading of various industries, the size of wafers is gradually increasing. Therefore, the current chip mounting and bonding head mechanism obviously needs to be improved and upgraded to adapt to the large size of wafers. [0003] In order to satisfy the loading operation of large-size wafers, especially 12-inch wafers, many improvements to the welding head mechanism currently focus on improving the length of the welding head. By making the length of the welding head longer, it can adapt to the larger wafer size. However, this setting will increase t...

AI Technical Summary

Problems solved by technology

However, such a setting will increase the weight of the welding head, which will affect the loading accuracy and speed of the welding head, and will also increase the burden on the motor and other mechanisms. While increasing power consumption, it may also affect the The stability and service life of the welding head mechanism are affected

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