Chip packaging equipment for 12-inch wafers

A chip packaging and equipment technology, applied in the manufacture of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problem of the increased weight of the welding head, the influence of the stability and service life of the welding head mechanism, the impact of the welding head loading accuracy and speed, etc. problem, to achieve the effect of improving the loading range

Active Publication Date: 2018-11-02
SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, such a setting will increase the weight of the welding head, which will affect the loading accuracy and speed of the welding head, and will also increase the burden on the motor and other mechanisms. While increasing power consumption, it may also affect the The stability and service life of the welding head mechanism are affected

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  • Chip packaging equipment for 12-inch wafers
  • Chip packaging equipment for 12-inch wafers
  • Chip packaging equipment for 12-inch wafers

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Embodiment Construction

[0026] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0027] In order to achieve the purpose of the present invention, such as Figure 1-3 As shown, in some embodiments of the chip packaging equipment suitable for 12-inch wafers of the present invention, it includes a base 41, a glue dispensing mechanism 42, a packaging table 43, a wafer table 44, and a chip mounting and bonding head mechanism 5. The chip loading head mechanism 5 includes: a sliding mounting frame 1, which is driven by the first drive unit 11 to slide back and forth in the horizontal direction; the chip loading head 2, which is mounted on the output shaft of the second drive unit 21, and the loading A third drive unit 23 is installed on the chip bonding head 2 and is driven by the third drive unit 23 to rotate 360 ​​degrees. The second drive unit 21 is also fixedly installed on the sliding mounting frame 1; The four-drive unit 4...

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Abstract

The invention discloses chip packaging equipment suitable for a 12inch wafer. The chip packaging equipment comprises a slide mounting rack and a loading welding head, wherein the slide mounting rack is driven by a first drive unit to slide back and forth along a horizontal direction; the loading welding head is arranged on an output shaft of a second drive unit; a third drive unit is arranged on the loading welding head and drives the loading welding head to rotate at 360 degrees; the second drive unit is also fixedly arranged on the slide mounting rack; and meanwhile, a wafer supporting stage is driven by a fourth drive unit to rotate at 180 degrees. Compared with the prior art, the length of the loading welding head does not need to improve, so that the loading accuracy and speed of the loading welding head are not affected; and the welding head can carry out reciprocating drive between an unloading position and a loading position within the shortest possible time. Meanwhile, the power consumption and the service lifetime of the loading welding head are not affected; and a loading operation on the 12inch wafer can be finished under the premise of not changing the structure of the loading welding head.

Description

Technical field [0001] The invention relates to the field of semiconductor packaging equipment, in particular to a chip packaging equipment suitable for 12-inch wafers. Background technique [0002] In the current chip packaging equipment, the chip mounting and bonding head mechanism usually controls its rotation through a motor to complete the process of crystal fetching and chip mounting. With the advancement of technology and the upgrading of various industries, the size of wafers is gradually increasing. Therefore, the current chip mounting and bonding head mechanism obviously needs to be improved and upgraded to adapt to the large size of wafers. [0003] In order to satisfy the loading operation of large-size wafers, especially 12-inch wafers, many improvements to the welding head mechanism currently focus on improving the length of the welding head. By making the length of the welding head longer, it can adapt to the larger wafer size. However, this setting will increase t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67126
Inventor 王敕
Owner SUZHOU ACCURACY ASSEMBLY AUTOMATION CO LTD
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