Heat radiation device for LED automobile lens

A heat dissipation device and lens technology, applied in cooling/heating devices, signaling devices, lighting devices, etc. Efficiency, friction-intensive effect

Inactive Publication Date: 2016-01-27
HAIYAN LIGUANG ELECTRONICS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] refer to figure 1 , the heat dissipation structure of the existing LED automotive lens includes a fan and a heat dissipation support, wherein the heat dissipation support includes straight heat dissipation fins; the heat dissipation support plays the function of dissipating heat for the LED chip when the LED chip and the reflector cup are installed, but due to It adopts straight heat dissipation fins, which are almost parallel to the airflow direction formed by the fan, the friction between the airflow and the heat dissipation fins is weak, and the heat dissipation effect is poor; in addition, a part of the airflow, such as airflow 2, collides with airflow 1 after rebounding from the heat dissipation bracket , forming turbulent flow, seriously affecting the cooling effect

Method used

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  • Heat radiation device for LED automobile lens
  • Heat radiation device for LED automobile lens

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with accompanying drawings and embodiments thereof.

[0015] refer to figure 2 , the heat dissipation structure of LED automobile lens of the present invention, comprises cooling fan 1, support 2 and cooling fin 3; It is characterized in that: cooling fan 1 is positioned at the afterbody of support 2, and support 2 is provided with cooling fin 3. The airflow formed by the cooling fan 1 is blown horizontally to the bracket 2; the upper and lower surfaces of the bracket 2 are used to install LED chips and reflector cups; the cooling fins 3 include a plurality of fins arranged on the lower surface of the bracket 2; the fins of the cooling fins 3 The airflow direction formed by the fan 1 is curved to the left and right sides in a circular arc shape.

[0016] The working principle of the present invention is: the airflow formed by the heat dissipation fan 1 is blown to the heat dissipation fins 3. Since t...

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Abstract

The invention discloses a heat radiation device for an LED automobile lens. The problems that an existing heat radiation structure is low in heat radiation efficiency and poor in heat radiation effect are mainly solved. The heat radiation device comprises a cooling fan (1), a support (2) and cooling fins (3). The cooling fan (1) is located at the tail of the support (2), and the cooling fins (3) are arranged on the support (2). Airflow formed by the cooling fins (3) is horizontally blown to the support (2). The upper surface or the lower surface or the upper surface and the lower surface of the support (2) are used for allowing LED chips and reflecting cups to be mounted. The cooling fins (3) comprise one or more fin bodies and are arranged on the upper surface or the lower surface or the upper surface and the lower surface of the support (2). The fin bodies of the cooling fins (3) are bent towards the left side and the right side in an arc shape in the direction of the airflow formed by the fan (1). The heat radiation device is high in heat radiation efficiency and good in heat radiation effect, dust is prevented from being blown to a lens body of the LED automobile lens at the front end of the support through the airflow, and the transmissivity of the lens body is guaranteed.

Description

technical field [0001] The invention relates to the field of automotive lighting equipment, in particular to a heat dissipation device used for LED automotive lenses. Background technique [0002] Light-emitting diodes, like traditional light sources, also generate heat during operation, and the higher the luminous efficiency, the less heat generated. At present, the efficiency of LED to convert electrical energy into light energy can only reach 30% to 40%, and the rest of the energy is mainly converted into heat energy in the form of lattice vibration generated by the non-radiative recombination of electrons and holes. As a kind of semiconductor device, the service life of LED will decrease with the increase of temperature, and when the temperature is higher than a certain level, the luminous efficiency of LED will decrease. Therefore, the heat dissipation structure plays an important role in the application of LED. critical use. With the popularity of LED in the field of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S8/10F21V29/504F21V29/67F21V29/74F21W101/02F21Y115/10F21W107/10
CPCF21S45/43F21W2107/10
Inventor 陈斌杰沈国野韩杰
Owner HAIYAN LIGUANG ELECTRONICS TECH CO LTD
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