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Disposable surface-enhanced Raman spectroscopy chip and preparation method

A surface-enhanced Raman, one-time technology, applied in the direction of Raman scattering, material excitation analysis, etc., can solve unapplied problems, and achieve the effects of low production cost, enhanced vibration signal, and uniform pore size

Pending Publication Date: 2016-01-27
ZHEJIANG UNIV OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, its porous nature is mostly used in the field of electrocatalysis, but not in surface-enhanced Raman spectroscopy.

Method used

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  • Disposable surface-enhanced Raman spectroscopy chip and preparation method
  • Disposable surface-enhanced Raman spectroscopy chip and preparation method
  • Disposable surface-enhanced Raman spectroscopy chip and preparation method

Examples

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Embodiment Construction

[0027] A kind of disposable surface-enhanced Raman spectroscopy chip prepared in this embodiment, such as figure 1 As shown, it is a sheet structure, including the bottom layer 3, the middle layer 2 and the surface layer 1, the bottom layer 3 is an insulating substrate, the middle layer 2 is a conductive layer, and the conductive layer is made of conductive material or formed by screen printing or vacuum evaporation. Or it is formed by sputtering, the metal material used is silver, and the surface layer 1 is a porous nano-silver dendritic structure with a surface-enhanced Raman spectrum effect.

[0028] Prepare a method for preparing a disposable surface-enhanced Raman spectroscopic chip as described above, form an intermediate layer 2, that is, a conductive layer, on the bottom layer 3 insulating substrate by screen printing or vacuum evaporation or sputtering, and Conducting electrodeposition reaction treatment at room temperature to obtain a surface layer 1 with a surface-e...

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Abstract

A disposable surface-enhanced Raman spectroscopy chip is in a flaky structure, and includes a bottom layer, a middle layer and a surface layer, the bottom layer is an insulating substrate, the middle layer is a conductive layer, and the surface layer is a coating layer with surface-enhanced Raman spectroscopy effect. A preparation method of the disposable surface-enhanced Raman spectroscopy chip is as follows: the conductive layer is formed on the insulating substrate by screen printing method or vacuum evaporation or sputtering method, and a coating film with the surface-enhanced Raman spectroscopy effect can be obtained by electrodeposition treatment at room temperature. The surface layer nano structure has larger roughness, namely larger specific surface area, can load more to-be-tested molecules, and has a certain role to enhance the Raman signal. The disposable surface-enhanced Raman spectroscopy chip has low production cost and price advantage, can be used in one time and disposable to reduce interference and reuse pollution problems, after the test, surface cleaning treatment is not needed, and the disposable surface-enhanced Raman spectroscopy chip is easy to use.

Description

technical field [0001] The invention relates to the field of Raman spectroscopy detection, in particular to a disposable surface-enhanced Raman spectroscopy (Surface enhanced Ramanscattering, SERS) chip and a preparation method thereof. Background technique [0002] Conventional Raman spectroscopy is generally difficult to use for trace molecular detection due to its low detection sensitivity. At present, a lot of research focuses on the development of various substrates with surface-enhanced Raman spectroscopy effects, mainly rough metal surfaces treated by oxidation-reduction reactions; metal nanoparticles deposited on glass by means of physical evaporation, sputtering, etc. Substrates with different material surfaces; metal sols with spherical, rod-shaped, core-shell structures, etc.; MFON that self-assembles monodisperse gold or silver nanoparticles on an inert substrate to form an array in a certain way (Northwestern University VanDuyne research group) ; Photonic cryst...

Claims

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Application Information

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IPC IPC(8): G01N21/65
Inventor 滕渊洁刘文涵
Owner ZHEJIANG UNIV OF TECH
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