High-frequency adhesive glue laminated structure and preparation method thereof

Abstract

The invention discloses a high-frequency adhesive glue laminated structure. The high-frequency adhesive glue laminated structure comprises a first high-frequency glue layer, a second high-frequency glue layer and a third high-frequency glue layer, wherein each of the first, second and third high-frequency glue layers is made of a mixture of fluorine resin and thermosetting resin; the total thickness of the high-frequency adhesive glue laminated structure is 15-75 microns; in the first high-frequency glue layer, the fluorine resin accounts for 15-25% of the total solid, and the first high-frequency glue layer is 2-10 microns in thickness; in the second high-frequency glue layer, the fluorine resin accounts for 60-80% of the total solid, and the second high-frequency glue layer is 10-55 microns in thickness; in the third high-frequency glue layer, the fluorine resin accounts for 15-25% of the total solid, and the first high-frequency glue layer is 2-10 microns in thickness. The high-frequency adhesive glue laminated structure is very low in Dk and Df performance, and the Df value can reach up to 0.003, so that signal transmission loss can be greatly reduced to accordingly improve the signal transmission quality effectively, the possibility of message judgment error is reduced, and meanwhile, the high-frequency adhesive glue laminated structure is prepared according to a simple method.

Description

technical field [0001] The invention relates to a high-frequency adhesive glue, in particular to a high-frequency adhesive glue with low Dk and Df characteristics, which can be used for interlayer bonding of signal transmission circuit boards, can greatly reduce the loss of signal transmission, and is more efficient Improve the quality of signal transmission and reduce the occurrence of wrong message judgments. Background technique [0002] In the early days of high-speed information communication requirements such as military satellite communications, it was necessary to seek component carriers with superior high-frequency characteristics, especially the dielectric characteristics of the GHz band are very important, so the dielectric constant of the product should be low. When the dielectric constant becomes smaller, the transmission delay The time is shortened and the transmission speed is accelerated. With the opening of the bandwidth, the wireless communication for peopl...

AI Technical Summary

Problems solved by technology

However, the glass transition temperature of fluororesin is close to room temperature, making it as stable as ordinary thermoplastic resins, and it is not as good as thermosetting resin materials in terms of mechanical strength and thermal conductivity, so it must be processed in the production of printed circuit boards. Many special pre-plating treatments, and it is more difficult in forming and machining

This makes it impossible to manufacture high-density PCB (Printed circuit board, printed circuit board) and high-multilayer PCB products with fluorine-containing resin substrates.

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