Electroplating device and electroplating method for electrodepositing different platings on double sides

An electroplating device and electrodeposition technology, applied in the direction of electrolysis components, electrolysis process, etc., can solve the problems of wasting time, cumbersome experiments, etc., and achieve the effect of easy operation and simple structure

Inactive Publication Date: 2016-02-03
CHINA HUANENG GRP CO LTD +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Experiments are tedious and time-consuming

Method used

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  • Electroplating device and electroplating method for electrodepositing different platings on double sides
  • Electroplating device and electroplating method for electrodepositing different platings on double sides
  • Electroplating device and electroplating method for electrodepositing different platings on double sides

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Embodiment Construction

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, so as to describe the technical solution of the present invention in detail.

[0027] see figure 1 , the electroplating device for double-sided electrodeposited heterogeneous coatings of the present invention is used to realize simultaneous electrodeposition on both sides of the plate to be plated in different electroplating environments. The present invention includes an electroplating tank body 1 , a first pulse power supply 2 , a second pulse power supply 3 , a wire 4 , a first anode 5 and a second anode 6 , a plate to be plated 7 and a fastening device 8 . A plate to be plated 7 is arranged between the first anode 5 and the second anode 6 in the electroplating tank body 1, the first anode 5 is connected to the positive pole of the first pulse power supply 2, and the second anode 6 is connected to the second pulse power supply 3 positive elec...

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Abstract

The invention discloses an electroplating device and electroplating method for electrodepositing different platings on double sides. The electroplating device comprises a first pulse power supply, a second pulse power supply, and a first anode and a second anode arranged in an electroplating bath body, wherein a to-be-plated plate is arranged between the first anode and the second anode; the first anode is connected with the positive pole of the first pulse power supply; and the second anode is connected with the positive pole of the second pulse power supply. According to the invention, the first anode and the second anode are arranged in the electroplating bath body, after different electroplate liquids are poured into the electroplating bath body, parameters such as pulse interval and pulse width are set through a program, and the different platings are simultaneously electrodeposited on the double sides of the to-be-plated plate in different electroplating environments by virtue of the two single pulse power supplies; the electroplating device and the electroplating method are particularly applicable to preparation of battery lead plates of which the double sides have different platings, and the like; the device is simple in structure and easy to operate.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to an electroplating device and an electroplating method for double-sided electrodeposition of heterogeneous coatings. Background technique [0002] The electroplating device currently used in electroplating is developed based on the Hall cell. The Hall tank is a small electroplating test tank designed by Hull in 1935, which consists of a single plane cathode and a single plane anode to form a certain slope. The bottom surface of the Hall cell in the prior art is trapezoidal, and the cathode and the anode are respectively placed on two non-parallel sides. When in use, the electroplating solution to be plated is filled in the tank body, and the plate to be plated is fixed as a cathode. Under the action of the bipolar electric field, the metal ions in the electroplating solution move directional and are adsorbed on the plate to be plated as the cathode, thereby realizing electroplating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D5/18C25D17/00
Inventor 杨珍鲁金涛袁勇谷月峰赵新宝党莹樱尹宏飞
Owner CHINA HUANENG GRP CO LTD
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