Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Sensor devices and encoders

A sensor device and encoder technology, applied in the direction of the casing of the measuring device, can solve the problems of foreign matter movement and cost increase, and achieve the effect of preventing or suppressing circuit short circuit and preventing conductive foreign matter from adhering to electronic components and circuit boards.

Active Publication Date: 2017-12-15
SANKYO SEIKI MFG CO LTD
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the technique of covering the circuit board with resin, there is a problem that the cost of manufacturing the device on which the circuit board is mounted increases.
[0007] On the other hand, in the technique of covering a circuit board with a cover member, conductive foreign matter adhering to the surface of the circuit board before covering the circuit board with the cover member may move between the cover member and the circuit board over time.
For example, in the circuit board of a magnetic sensor device (magnetic encoder) equipped with a sensor that detects the displacement of a magnet attached to a rotating body, the magnetic field changes due to the displacement of the magnet, which may cause Foreign objects made of magnetic materials move

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Sensor devices and encoders
  • Sensor devices and encoders
  • Sensor devices and encoders

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] Hereinafter, as an embodiment to which the present invention is applied, a magnetic rotary encoder mounted on a motor will be described with reference to the drawings.

[0053] (the whole frame)

[0054] Figure 1(a) to Figure 1(c)It is an explanatory diagram of a motor unit equipped with a rotary encoder to which the present invention is applied. Fig. 1(a) is a perspective view of the motor unit viewed from the output side protruding from the output shaft, Fig. 1(b) is a perspective view of the motor unit viewed from the opposite output side opposite to the output side, and Fig. 1(c) is viewed from the output side A perspective view of a state in which the encoder case and the cover member are removed from the motor unit when viewed from the opposite side. figure 2 It is a sectional view of the rotary encoder installed in the motor unit.

[0055] The motor unit 1 has: a unit main body 2 having a rectangular parallelepiped shape as a whole; and an output shaft 3 prot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a sensor device and an encoder. This sensor device can suppress the movement of conductive foreign matter adhering to the surface of the circuit board, and protect the surface of the circuit board with a simple structure. A magnetic sensor device (11) (sensor device) has a circuit board (16) mounted with electronic components (25) on a surface (16a) and an elastically deformable dustproof member (18). The dustproof member covers the surface (16a) of the circuit board in a state of being pressed against the electronic component and the circuit board. In the case where conductive foreign matter adheres to the circuit board, the foreign matter is held between the dustproof member and the circuit board or between the dustproof member and the electronic component, and movement of the foreign matter is suppressed. After the circuit board is covered with the dustproof member, it is possible to prevent conductive foreign matter from adhering to the electronic components and the circuit board. Therefore, it is possible to prevent or suppress a short circuit caused by conductive foreign matter.

Description

technical field [0001] The invention relates to a sensor device comprising a circuit board and an encoder. Background technique [0002] When foreign matter such as conductive dust adheres to the surface of a circuit board on which electronic components are mounted, a circuit formed on the circuit board may be short-circuited. [0003] Patent Documents 1 and 2 describe techniques capable of preventing foreign matter from adhering to the surface of a wiring board. In Patent Document 1, the surface of the circuit board is covered with resin. In Patent Document 2, the surface of the circuit board is covered with an air permeable cover member. [0004] Patent Document 1: Japanese Patent Application Laid-Open No. H10-41680 [0005] Patent Document 2: Japanese Patent Laid-Open No. 2003-133703 [0006] In order to cover the surface of the circuit board with resin, it is necessary to perform an operation process of laminating the resin layer on the circuit board in the process o...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01D11/24
Inventor 斋藤豊
Owner SANKYO SEIKI MFG CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com