A silicon chip damage detection device and detection method

Abstract

The invention discloses a silicon wafer damage detection device, comprising: a frame, a first conveying unit, a second conveying unit and a third conveying unit used to sequentially transport the silicon wafer backwards, used for detecting the damage of the silicon wafer The unit is a damaged collection box for collecting damaged silicon wafers, and an abnormal collection box for collecting silicon wafers when the equipment is abnormal. The damage detection unit, the first conveying unit, the second conveying unit and the third conveying unit are all connected to a central controller. The present invention also proposes a detection method of the above-mentioned silicon chip damage detection equipment. The invention can automatically detect regular silicon wafers in batches on-line, and can automatically process the silicon wafers according to the detection results.

Description

technical field [0001] The invention relates to the technical field of silicon wafer detection equipment, in particular to a silicon wafer damage detection device and a detection method. Background technique [0002] Wafer production is an important link in the solar photovoltaic industry chain. Silicon wafer products need to undergo strict quality inspection, and the appearance and shape of silicon wafers directly affect the quality of solar cells. In the traditional technology, the regular shape detection of silicon wafers is mainly observed with the naked eye, or with a simple lens. In the process of taking the silicon wafer, it is easy to cause damage and contamination of the silicon wafer. [0003] In the prior art, an automatic detection system for the appearance of silicon wafers has been adopted, such as the utility model patent with the announcement number CN201844980U, which mainly uses a camera to cooperate with a backlight source to photograph the silicon wafer...

AI Technical Summary

Problems solved by technology

In the traditional technology, the inspection of the shape of regular silicon wafers is mainly observed by human eyes, or using a simple lens for detection. In the process of taking silicon wafers, it is easy to cause damage and pollution of silicon wafers

[0003] In the prior art, there is an automatic inspection system for the appearance of silicon wafers, such as the utility model patent with the announcement number CN201844980U, which mainly uses a camera with a backlight to take pictures of the silicon wafers to be inspected, and analyzes the photos taken to detect whether there is damage. But it has the following defects: 1. Silicon wafers need to be loaded or unloaded by a single robot arm, which can easily cause damage to the silicon wafers and affect product quality; 2. High precision requirements for the robot arm, and the detection and collection of silicon wafers It cannot be carried out coherently, and the work efficiency is low, so it is not suitable for batch processing and production of silicon wafers

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