Automatic semiconductor wafer positioning device

Abstract

The invention discloses an automatic semiconductor wafer positioning device. The automatic semiconductor wafer positioning device comprises three parts of a vision system, a multi-directional moving platform and a test probe, wherein the vision system comprises a camera, a microscope and a light source, the multi-directional moving platform comprises X, Y, Z and theta platforms and a wafer supporting table arranged on the theta platform, and the test probe is electrically connected with an external test instrument. Through the automatic semiconductor wafer positioning device, a wafer image is acquired through the camera, binary processing on the image is carried out, in a process of wafer level angle adjustment and test origin alignment, a secondary template coupling method is respectively employed to realize the automatic wafer alignment function.

Description

technical field [0001] The invention relates to an automatic positioning device for semiconductor wafers, which is applied on a GPP bare crystal diode wafer test probe platform, and can also be used for testing products such as triodes and integrated circuits. Background technique [0002] In the field of semiconductor wafer testing, wafer pre-alignment work is the premise of subsequent testing work. Failure in alignment or errors that cannot meet the requirements will directly lead to failure of subsequent testing work, resulting in a great waste of manpower and material resources. However, as the chip size becomes smaller and smaller, it is difficult to meet the production requirements in terms of accuracy and speed of traditional human eye alignment or alignment with the aid of a microscope. In particular, during the testing process of diode wafers, many diode wafer manufacturers produce wafers without cut edges or notches, and wafer pre-alignment cannot be completed by d...

AI Technical Summary

Problems solved by technology

[0002] In the field of semiconductor wafer testing, wafer pre-alignment work is the premise of subsequent testing work. Failure in alignment or errors that cannot meet the requirements will directly lead to failure of subsequent testing work, resulting in a great waste of manpower and material resources

As the size of the chip becomes smaller and smaller, the traditional human eye alignment or microscope alignment methods are difficult to meet the production requirements in terms of accuracy and speed.

In particular, during the testing process of diode wafers, many diode wafer manufacturers produce wafers without trimming or notches, and cannot complete wafer pre-alignment by detecting trimming or notches

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