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Automatic semiconductor wafer positioning device

An automatic positioning and semiconductor technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of difficulty in meeting production requirements in precision and speed, failure of test work, waste of manpower and material resources, etc., and achieve automatic wafer alignment Accurate effect

Inactive Publication Date: 2016-02-03
秦皇岛视听机械研究所有限公司
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AI Technical Summary

Problems solved by technology

[0002] In the field of semiconductor wafer testing, wafer pre-alignment work is the premise of subsequent testing work. Failure in alignment or errors that cannot meet the requirements will directly lead to failure of subsequent testing work, resulting in a great waste of manpower and material resources
As the size of the chip becomes smaller and smaller, the traditional human eye alignment or microscope alignment methods are difficult to meet the production requirements in terms of accuracy and speed.
In particular, during the testing process of diode wafers, many diode wafer manufacturers produce wafers without trimming or notches, and cannot complete wafer pre-alignment by detecting trimming or notches

Method used

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  • Automatic semiconductor wafer positioning device

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Embodiment Construction

[0017] Such as figure 1 The semiconductor wafer automatic positioning device shown includes three parts: a vision system, a multi-directional mobile platform and a test probe. The vision system described in the present invention includes a camera, a microscope, and a light source; the vision system is used to extract wafer image features. The multi-directional mobile platform includes Y, X, Z, θ platforms, and the wafer stage 4 installed on the θ platform; the multi-directional mobile platform is used to control wafer movement. The test probes are used to make contact with the wafer. In the vision system of the present invention, the front end of the imaging lens of the camera 1 is sequentially installed with a microscope 2 and a light source 3 , and installed on the frame 11 through the camera 1 . In the present invention, the test probe 8 is aligned and contacted with the wafer 5, and the test probe 8 is integrally installed on the frame 11 of the vision system, and the re...

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Abstract

The invention discloses an automatic semiconductor wafer positioning device. The automatic semiconductor wafer positioning device comprises three parts of a vision system, a multi-directional moving platform and a test probe, wherein the vision system comprises a camera, a microscope and a light source, the multi-directional moving platform comprises X, Y, Z and theta platforms and a wafer supporting table arranged on the theta platform, and the test probe is electrically connected with an external test instrument. Through the automatic semiconductor wafer positioning device, a wafer image is acquired through the camera, binary processing on the image is carried out, in a process of wafer level angle adjustment and test origin alignment, a secondary template coupling method is respectively employed to realize the automatic wafer alignment function.

Description

technical field [0001] The invention relates to an automatic positioning device for semiconductor wafers, which is applied on a GPP bare crystal diode wafer test probe platform, and can also be used for testing products such as triodes and integrated circuits. Background technique [0002] In the field of semiconductor wafer testing, wafer pre-alignment work is the premise of subsequent testing work. Failure in alignment or errors that cannot meet the requirements will directly lead to failure of subsequent testing work, resulting in a great waste of manpower and material resources. However, as the chip size becomes smaller and smaller, it is difficult to meet the production requirements in terms of accuracy and speed of traditional human eye alignment or alignment with the aid of a microscope. In particular, during the testing process of diode wafers, many diode wafer manufacturers produce wafers without cut edges or notches, and wafer pre-alignment cannot be completed by d...

Claims

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Application Information

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IPC IPC(8): H01L21/68
CPCH01L21/681
Inventor 于国辉刘红军杨刚郑金宝李艳霞刘宵婵
Owner 秦皇岛视听机械研究所有限公司
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