Single-point multi-conductor wiring process

Abstract

The invention discloses a single-point multi-conductor wiring process. The single-point multi-conductor wiring process comprises the following steps of selecting at least one wire as a carrier wire and a plurality of wires as wound wires; peeling an insulation layer at one end of the carrier wire to form a contact part, and peeling an insulation layer at one end of each wound wire to form a winding part; allowing the winding part of at least one wound wire to be wound at the contact part, near to an insulation layer end, of the carrier wire by a close winding method; carrying out electroplating on the winding part and the contact part of a segment where the winding is wound to allow the carrier wire and the wound wires to form an integrated tin layer; disassembling core wires at the end parts of all contact parts which are not wound with the wound wires, winding the core wires together to form a welding part after twisting, and carrying out electroplating on the welding part to allow all carrier wires to form the integrated tin layer; and welding the welding part plated with the tin layer on a welding point by a welding mode.

Description

technical field [0001] The invention relates to the field of wiring, in particular to a single-point multi-conductor wiring technology. Background technique [0002] At present, when multiple wires are welded on the same solder joint, due to the large number of wires, the area of ​​the end surface is much larger than the area of ​​the solder joints, which is not convenient for welding. Therefore, the commonly used wiring method is to cut some wires (cut off the wires). Part of the core wire), and then multiple wires are combined and welded on a joint. Welding in this way has the following disadvantages: due to cutting off part of the core wire during wiring, the current passing through a single wire is uneven; when the cable is bent, some wire roots will break, resulting in uneven force and current. Uniform situation; when the cable bundle is stressed, the quality of the wires may be off or broken. Furthermore, using cut wires to connect multiple wires also violates the pr...

AI Technical Summary

Problems solved by technology

[0003] Aiming at the above-mentioned shortcomings in the prior art, the single-point multi-conductor wiring technology provided by the present invention solves the problem that the force of multiple conductors and the current passing through the conductors are not uniform due to the winding of multiple conductors and the processing of wire cutting.