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A large component igbt press-fit unit

A large-component, press-fit technology, applied in electrical components, semiconductor devices, electric solid devices, etc., can solve the problems of inconvenient pressure loading, inaccurate pressure control, lack of elasticity in the structure, and meet the requirements of structural stability and strength. , the effect of uniform dispersion and reliable press-fit, compact insulation design

Active Publication Date: 2018-10-23
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the relatively common reference thyristor press-fitting frame is a rigid frame composed of insulating laminated plates and metal structural parts through fastening bolts. Although this frame has a stable structure and high strength, it is heavy and cumbersome, and the structure lacks elasticity. , Poor ability to adapt to the dimensional elastic changes of the IGBT press-fitting mechanism
The frequency converters on some power migration locomotive equipment use crimping IGBTs, and the press-fitting mechanism adopts a press-fitting frame with metal structural parts and insulating tie rods. Limited by the transverse shear strength of the insulating tie rods, they basically adopt hoisting design. Very poor flexibility and low reliability
The pressure loading type of the IGBT press-fitting mechanism also has a variety of designs. There is a structure that presses through the center of a single bolt. This structure is inconvenient for installation and maintenance, and the pressure control is not accurate; The operation is complicated, the pressure loading is inconvenient, and it is difficult to ensure that the pressure is evenly distributed
For the press-fit IGBT, since the thickness of the IGBT has a large deformation displacement when a single device is press-fitted, it is very inconvenient to press-fit and disassemble. So far, there is no relevant large-component IGBT from the available literature Reference technology route for press fitting pressure adaptive design
[0005] What needs to be emphasized is that the domestic application of IGBT press-fit technology has not yet achieved design patents for IGBT press-fit at high voltage levels above 10 levels.

Method used

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  • A large component igbt press-fit unit
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Embodiment Construction

[0033] The specific embodiments of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0034]A large-component IGBT press-fit unit proposed by the present invention uses a support and fixation structure composed of metal tie rods and metal end plates as a carrier, and realizes pressure loading and pressure uniform dispersion by cooperating with press-fit stress cones and pressure self-adaptive adjustment mechanisms; The disc spring mechanism realizes long-term pressure maintenance and deformation adaptation, and the high potential isolation between the support structure and the IGBT is realized through the insulating isolation disc. In order to ensure the long-term structural stability of the IGBT during operation and avoid the adverse effects of various external impact loads on the performance of the IGBT, the press-fitting unit is designed with a precise centering mechanism to effectively protect the IGBT and meet i...

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Abstract

A large-component IGBT press fitting unit, comprising a support frame (14) and a press fitting unit that is located in the support frame (14) and is used for fixing an IGBT valve series. The press fitting unit comprises: press fitting stress cones (11) located at the two ends of the IGBT valve series, a pressure adaptive adjusting mechanism and an insulated isolation structure; and the press fitting stress cones (11) and the pressure adaptive adjusting mechanism are respectively and fixedly connected to metal end plates (01) arranged at the two ends of the support frame (14), and the insulated isolation structure is used for realizing electric isolation of the press fitting structure from electrical components.

Description

technical field [0001] The invention relates to the field of high-voltage power transmission, in particular to a large-component IGBT press-packing unit. Background technique [0002] With the development of high-power power electronics technology, especially the development of high-voltage flexible DC transmission and flexible AC transmission, IGBT devices, especially the flexible and controllable turn-off characteristics, are more and more widely used in power systems. With the continuous improvement of power transmission capacity, IGBT devices with high withstand voltage, high flow capacity and large cross-sectional size are becoming popular and applied. The early IGBT devices were mainly welded. This kind of device adopts the design structure of bolts fixed on the heat sink. The circuit device makes the application design of this type of IGBT complicated and limits its extended application in the engineering field. In response to this problem, a new type of crimping IG...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/00H01L23/32H01L23/367H01L25/11
CPCH01L23/00H01L23/32H01L23/367
Inventor 张升王成昊魏晓光王新颖
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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