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A Miniaturized High Density Integrated T/R Module Structure

A modular structure, high-density technology, applied to electrical components, transmission systems, etc., can solve the problems of heavy weight and large volume, and achieve the effects of light weight, enhanced heat dissipation, and miniaturization

Active Publication Date: 2017-10-31
成都雷电微力科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to overcome the problems of large volume and heavy weight of the existing T / R module components, and provide a small volume, light weight, miniaturized and high-density integrated T / R module structure

Method used

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  • A Miniaturized High Density Integrated T/R Module Structure
  • A Miniaturized High Density Integrated T/R Module Structure
  • A Miniaturized High Density Integrated T/R Module Structure

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Embodiment Construction

[0026] The present invention will be further described in detail below in conjunction with test examples and specific embodiments. However, it should not be understood that the scope of the above subject matter of the present invention is limited to the following embodiments, and all technologies realized based on the content of the present invention belong to the scope of the present invention.

[0027] A miniaturized high-density integrated T / R module structure, such as figure 1 As shown, it includes a box-shaped first T / R module package 1 and a second T / R module package 2, the first T / R module package 1 and the second T / R module package 2 Integrate the radio frequency chipset in the channel to complete the sending and receiving work of the T / R module.

[0028] The first T / R module packaging body 1 and the second T / R module packaging body 2 are interlocked to form a fastening cavity.

[0029] see figure 1 , a voltage regulating board 100 is provided on one side of the fas...

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Abstract

The invention discloses a mini-type high-density integrated T / R module structure. The mini-type high-density integrated T / R module structure comprises a box-shaped first T / R module package body and a box-shaped second T / R module package body, and a channel internal radio frequency chipset is respectively integrated in the first T / R module package body and the second T / R module package body; the first T / R module package body and the second T / R module package body are mutually clamped to form a clamping cavity; a voltage adjusting plate is arranged on one surface, close to the first T / R module package body, of the interior of the clamping cavity, and a T / R module in the first T / R module package body is connected with the voltage adjusting plate; meanwhile, a control signal transmission plate is arranged on one surface, close to the second T / R module package body, of the interior of the clamping cavity, and a T / R module in the second T / R module package body is connected with the control signal transmission plate, and the voltage adjusting plate is electrically connected with the control signal transmission plate. The invention aims to provide a small-size, light-weight mini-type high-density integrated T / R module structure.

Description

technical field [0001] The invention relates to the field of microwave transceiver components, in particular to a miniaturized high-density integrated T / R module structure. Background technique [0002] The T / R module is a key component in the active phased array radar antenna. The structure of the existing TR module basically adopts the box structure. The radio frequency link inside the box structure uses a combination of multiple devices, making the product bulky and heavy; at the same time, the heat dissipation uses fins, which further increases the size and weight of the product. Contents of the invention [0003] The object of the present invention is to overcome the problems of large volume and heavy weight of the existing T / R module assembly, and provide a small-volume, light-weight, miniaturized and high-density integrated T / R module structure. [0004] In order to realize the above-mentioned purpose of the invention, the present invention provides the following t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04B1/3827
CPCH04B1/38
Inventor 吴凤鼎夏辉彭科管玉静李灿
Owner 成都雷电微力科技股份有限公司