Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board

Abstract

The invention discloses a multilayer circuit board expansion and shrinkage coefficient obtaining method and a manufacturing method of a multilayer circuit board. The multilayer circuit board expansion and shrinkage coefficient obtaining method comprises the following steps: providing multiple inner plates to be pressed and an outer plate, adding more than three targets to the inner layers, and enabling the targets between the multiple inner layers to be arranged in a staggered mode; performing lamination processing on the multiple inner layers and the outer layer; obtaining target position information of the multiple inner plates through an X-Ray target drilling machine; and according to the target position information of the inner plates, obtaining an expansion and shrinkage coefficient b of the inner plates through calculation. According to the multilayer circuit board expansion and shrinkage coefficient obtaining method, the targets between each inner plate is arranged in a staggered mode, and after the targets between the inner plates are arranged in a staggered mode, the target position information of the N-2 inner layers can be simultaneously obtained through the X-Ray target drilling machine, such that the expansion and shrinkage coefficient of each inner plate can be obtained according to the target position information of each inner plate, and the alignment accuracy of line patterns between the inner plates can be improved.

Description

technical field [0001] The invention relates to the technical field of manufacturing multilayer circuit boards, in particular to a method for obtaining expansion and contraction coefficients of multilayer circuit boards and a method for manufacturing multilayer circuit boards. Background technique [0002] The pressing process of multilayer circuit boards is to control the process of pressing plates by applying hot plate temperature, pressing pressure, controlling duration and vacuuming, so that the prepregs between adjacent layers of circuit boards are pressed into fully cured resin, and Bond multiple inner substrates and copper foils to form a multilayer circuit board to ensure the electrical and mechanical properties of the multilayer circuit board. The pressing methods of multilayer circuit boards include MassLam (large pressing method) and PinLam (pin positioning pressing method). Among them, for the commonly used MassLam process, the plate will expand and shrink after...

AI Technical Summary

Problems solved by technology

Then, for multilayer circuit boards with a high number of layers (6 layers and above), due to differences in the type of board, the residual copper rate on the inner layer board, and the pr

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