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An electromagnetic field-assisted diffusion connection device and method for a glass plate and a metal plate

A technology of diffusion connection and glass plate, which is applied in the field of connection of dissimilar materials, can solve the problems of inability to realize connection and inability to diffuse and move ions, and achieve the effect of improving connection strength

Active Publication Date: 2018-01-12
TAIYUAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the ions move along the direction of the electric field during the connection process, the ions cannot diffuse and move to the connection surface, and the connection cannot be achieved

Method used

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  • An electromagnetic field-assisted diffusion connection device and method for a glass plate and a metal plate
  • An electromagnetic field-assisted diffusion connection device and method for a glass plate and a metal plate
  • An electromagnetic field-assisted diffusion connection device and method for a glass plate and a metal plate

Examples

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Embodiment 1

[0028] This embodiment provides a glass plate-Kvar alloy plate diffusion connection.

[0029] Both the Kovar plate and the glass plate are square plates with a thickness of 2mm and a length of 40mm, and the glass composition: 5.0%Na 2 O, 3.6% B 2 o 3 , 4.2% Al 2 o 3 , 2.5%K 2 O, the rest are SiO 2 , the bonded surface of the glass plate and Kovar alloy plate is ground and polished, the surface roughness is less than 1μm, the electrode plate in contact with the glass has a length of 40mm, according to figure 1 Put the Kovar plate and the glass plate in the bonding furnace in the manner shown, heat the furnace to 400°C, turn on the high-voltage DC power supply and the low-voltage DC power supply, apply a DC voltage of 900V to the sample, and adjust the low-voltage power supply so that the magnetic field strength 0.5T, keep it for 5 minutes, turn off the heating power supply, high-voltage DC power supply and low-voltage DC power supply at the same time, and cool the sample...

Embodiment 2

[0032] This embodiment provides a glass plate-stainless steel plate diffusion connection.

[0033] Both the stainless steel plate and the glass plate are square plates with a thickness of 3mm and a length of 50mm, and the glass composition: 3.0%Na 2 O, 2.5% B 2 o 3 , 2.8% Al2 o 3 , 3%K 2 O, the rest are SiO 2 , the bonding surface of the glass plate and the Kovar alloy plate has been ground and polished, and the surface roughness is less than 1 μm. The electrode plate in contact with the glass has a width of 2.5 mm and a length of 50 mm. figure 1 Place the Kovar alloy plate and the glass plate in the bonding furnace in the manner shown, heat the furnace to 400°C, turn on the high-voltage DC power supply and the low-voltage DC power supply, apply a 600V DC voltage to the sample, and adjust the low-voltage power supply so that the magnetic field strength 1.0T, after keeping for 5 minutes, turn off the heating power supply, high-voltage DC power supply and low-voltage DC po...

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Abstract

The invention discloses an electromagnetic field-assistant glass plate and metal plate diffusion bonding device and method, and belongs to the technical field of dissimilar material connection. The section of a glass plate and a metal plate is connected so that the glass plate and the metal plate are perpendicularly connected, through use of an electromagnetic field, a movement direction of ions in the glass base is changed so that the ion movement diffusion direction diverges from the electromagnetic field and approaches to the connection interface, and the ions diffused to the glass plate and the metal plate interface react with the metal plate so that the glass plate and the metal plate are connected. The device provides a technical support for complex sensor component design.

Description

technical field [0001] The invention relates to an electromagnetic field-assisted diffusion connection device and method for a glass plate and a metal plate, and belongs to the technical field of connection of dissimilar materials. Background technique [0002] The connection between glass and metal plays an important role in the manufacturing process of microelectronic devices such as microsensors and microactuators. Anodic bonding is widely used in the connection process of glass plates and metal plates, but the anodic bonding process requires glass plates and The metal plates are stacked together and placed between two parallel electrode plates, an electric field perpendicular to the connection interface is applied, and the connection between the two is realized by applying an electric field and a temperature field. The distance between the two electrode plates is generally on the order of millimeters, so that a voltage of several hundred volts can be applied to achieve b...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C27/00
CPCC03C27/00
Inventor 胡利方王浩时方荣李育德陈少平王文先孟庆森
Owner TAIYUAN UNIV OF TECH
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