Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Correlation method of primary wiring diagram and secondary system logic connecting diagram of intelligent substation

A technology of intelligent substation and secondary system, applied in the direction of information technology support system, electrical components, circuit devices, etc., can solve the problems that the model is useless, the primary system model of the substation is out of touch with the secondary system, and the advantages are not fully reflected. range, easy matching effect

Active Publication Date: 2016-03-23
GRIDNT
View PDF9 Cites 34 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In fact, we only applied the communication service of the 61850 standard, and the model is only in name only, without fully reflecting the advantages of the standard, so there is a phenomenon that the substation primary system model is out of touch with the secondary system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Correlation method of primary wiring diagram and secondary system logic connecting diagram of intelligent substation
  • Correlation method of primary wiring diagram and secondary system logic connecting diagram of intelligent substation
  • Correlation method of primary wiring diagram and secondary system logic connecting diagram of intelligent substation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0052] In order to clearly illustrate the technical features of this solution, the present invention will be described in detail below through specific implementation modes and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily limiting the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

Provided is a correlation method of a primary wiring diagram and a secondary system logic connecting diagram of an intelligent substation. The method includes following processes: analyzing an SCD configuration file, obtaining secondary system basic information of the substation, and building a secondary system model of the substation; building a primary system model of the substation corresponding to the secondary system model; performing level division of IED equipment, and performing one-to-one parameter and channel configuration of primary system parameters and a data set in the secondary system IED; and performing simulation operation based on the primary system model, and displaying a substation main wiring diagram after the correlation of the secondary system model. According to the method, the problem of configuration of measuring parameters and switch parameters in the main wiring diagram is solved, primary and secondary equipment data closed-loop technical systems are established, the function of highly-visualized correlation analysis and debugging of the intelligent substation is realized based on the systems, the range of the selection of the IED equipment via correlation pairing is reduced, the correlation rate of the primary and secondary systems is increased, and the correlation process is more efficient and concise.

Description

technical field [0001] The invention relates to a method for associating primary and secondary equipment of a substation, in particular to a method for associating a wiring diagram of a primary system of an intelligent substation and a logical connection diagram of a secondary system, belonging to the technical field of power system automation. Background technique [0002] Smart substations are developed on the basis of digital substations, and are the latest requirements for substation technical forms in the smart grid environment. Networked information sharing is an important feature of smart substations. The optimization and integration of primary system and secondary system functions and the evolution of equipment forms are based on the premise of free information sharing. Digital network communication realizes multiple information multiplexing, and a small amount of optical fiber replaces a large number of cables in traditional substations. However, at the same time, d...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H02J13/00G06Q10/06G06Q50/06
CPCG06Q10/067G06Q50/06H02J13/0006H02J2203/20Y02E60/00Y04S10/18
Inventor 陈大川李惠民王乐挺
Owner GRIDNT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com