Heat dissipation device for silicon controlled rectifier bridge of welding machine
A technology of heat dissipation device and silicon rectification, which is applied in auxiliary devices, welding equipment, auxiliary welding equipment, etc., can solve the problems of reduced heat dissipation efficiency and easy accumulation of dust on heat sinks, so as to improve heat dissipation efficiency, increase heat dissipation area, and improve installation efficiency. The effect of convenience
Active Publication Date: 2017-04-12
YIXING JINGYE ELECTRONICS CO LTD
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Problems solved by technology
[0003] The problem with such a structure is that because the heat sink is located on one side of the bracket, the main heat dissipation is concentrated on the heat sink on one side of the bracket. At the same time, due to the working environment, the heat sink is easy to accumulate dust, making Reduced cooling efficiency
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[0021] Such as Figures 1 to 4 As shown, a welding machine thyristor rectifier bridge cooling device includes a first radiator 1, a second radiator 2 and two third radiators 3, the first radiator 1 and the second radiator 2 The upper part and the lower part are provided with a plurality of cooling fins 4, and the first radiator 1 and the second radiator 2 are connected, and the first radiator 1 and the second radiator 2 are provided with a connecting rod for connecting with the rectifier bridge. connected opening 5, the third heat sink 3 includes a base 3.1, a first heat dissipation column 3.2 and a second heat dissipation column 3.3, and the first heat dissipation column 3.2 and the second heat dissipation column 3.3 are connected to the base 3.1, so The angle between the first cooling column 3.2 and the horizontal plane is 40-55 degrees, the second cooling column 3.3 and the first cooling column 3.2 are symmetrical along the vertical line, and the first cooling column 3.2 an...
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The invention relates to a cooling device, in particular to a welding machine silicon controlled rectifier bridge cooling device which is high in cooling efficiency and convenient to disassemble and clean. The welding machine silicon controlled rectifier bridge cooling device comprises a first cooler, a second cooler and two third coolers. The upper portion and the lower portion of the first cooler are each provided with a plurality of cooling fins, and the upper portion and the lower portion of the second cooler are each provided with a plurality of cooling fins. The first cooler is connected with the second cooler. The first cooler and the second cooler are each provided with an opening used for being connected with a rectifier bridge. Each third cooler comprises a base, a first cooling post and a second cooling post, wherein the first cooling post and the second cooling post are both connected with the base, and the included angle between the first cooling post and the horizontal plane is 40-55 degrees; the second cooling post and the first cooling post are symmetrical along the vertical line, and the first cooling post and the second cooling post are each provided with a plurality of cooling fins. The bases are mounted on the first cooler and the second cooler respectively.
Description
technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device for a silicon controlled rectifier bridge of a welding machine. Background technique [0002] At present, the heat dissipation devices of the silicon controlled rectifier bridge of the welding machine in the prior art are all aluminum heat sinks formed by integral casting, wherein the specific mechanism includes a plurality of heat sinks and supports, and the heat sinks are arranged on one side of the support. And usually the entire cooling device will be directly fixed on the silicon controlled rectifier bridge of the welding machine by welding or screwing. [0003] The problem with such a structure is that because the heat sink is located on one side of the bracket, the main heat dissipation is concentrated on the heat sink on one side of the bracket. Heat dissipation efficiency is reduced. Contents of the invention [0004] Aiming at the problems in th...
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IPC IPC(8): B23K37/00
CPCB23K37/003
Inventor 刘秋林
Owner YIXING JINGYE ELECTRONICS CO LTD