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Method for measuring thicknesses of plating layers in electronic element with compound metal plating layers

A technology of metal coating and electronic components, which is applied in the field of analysis and detection, can solve the problems of large measurement results, difficult sample completion, increased time and cost, etc., and achieve the effects of good reproducibility of results, low cost and simple measurement methods

Active Publication Date: 2016-03-30
FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantage is that due to the ductility of metals such as gold, silver, and tin, the metal coating (especially the outermost metal coating) is stretched during the slice production process, causing false images, which directly cause the measurement results to be too large
However, the disadvantage of this method is that it will increase the preparation process, easily increase time and cost, and it is usually difficult to complete the sample during inspection

Method used

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Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0029] The present invention is described further below by embodiment.

[0030] In this embodiment, a method for measuring the thickness of each coating in an electronic component with a composite metal coating comprises the following steps:

[0031] The composite metal coating of the electronic component includes 4 successively stacked metal coatings, namely a first Ni metal coating, a first Au metal coating, a second Ni metal coating and a second Au metal coating;

[0032] (1) Preparation of medium sheet

[0033] In the preparation of the sample of the electronic component, the electroplating operation is performed on 4 culture medium sheets together with the sample of the electronic component, and one culture medium slice is taken out for each layer of metal plating;

[0034] (2) Determine the impact factor Δ

[0035] Adopting the x-ray fluorescence thickness gauge to measure the thickness of the first Ni metal coating of the corresponding culture medium sheet is x1=1.5 μ...

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Abstract

The invention discloses a method for measuring the thicknesses of plating layers in an electronic element with the compound metal plating layers. The method includes the following steps of firstly, preparing a culture substrate; secondly, determining an influence factor delta of the metal plating layers made of material M; thirdly, conducting measurement. By means of the method, the accurate measurement of the thicknesses of the compound metal plating layers in the electronic element can be achieved, especially when two metal plating layers made of the same material are included in the compound metal plating layers of the electronic element, the measurement method is easy and convenient to implement, cost is low, and result repeatability is high.

Description

technical field [0001] The invention relates to the technical field of analysis and detection, in particular to a method for measuring the thickness of each coating in a composite metal coating. Background technique [0002] The thickness of the coating is an important indicator to measure the quality of the coating. At present, the method of measuring the thickness of the coated metal is mainly to use the slice method for testing, and the measured surface is sliced ​​and then measured with a measuring tool. The disadvantage is that due to the ductility of metals such as gold, silver, and tin, the metal coating (especially the outermost metal coating) is extended during the slicing process to cause false images, which directly cause the measurement results to be too large. [0003] In the prior art, an X-ray fluorescence thickness gauge is usually used to measure the metal coating. This measurement method is simple and fast. It is impossible to measure the thickness of eac...

Claims

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Application Information

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IPC IPC(8): G01B15/02
CPCG01B15/02
Inventor 刘磊吕宏峰王小强牛付林卢思佳
Owner FIFTH ELECTRONICS RES INST OF MINIST OF IND & INFORMATION TECH
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