Die bonder
A technology of die bonding machine and fixing frame, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as poor control of glue quantity of die bonding machine, and achieve the effect of improving quality
Active Publication Date: 2016-03-30
深圳市大族封测科技股份有限公司
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Problems solved by technology
[0004] Based on this, in order to solve the problem of poor control of the amount of glue in the traditional die bonder, a die bonder that uses solder paste to fix the semiconductor device and the substrate and is suitable for the reflow soldering process is provided.
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[0044] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.
[0045] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and similar expressions are used herein for purposes of ill...
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The invention relates to a die bonder, which comprises a machine, a substrate mounting mechanism, a screen printing mechanism, a semiconductor device transmission mechanism and a device grab mechanism, wherein the substrate mounting mechanism is used for loading a substrate and is arranged on the machine; the silk-screen printing mechanism is used for printing a tin paste on the substrate in a silk-screen printing manner; the semiconductor device transmission mechanism is used for loading a semiconductor device, is arranged on the machine and is located at one side of the substrate mounting mechanism; and the device grab mechanism is used for grabbing the semiconductor device and placing the semiconductor device on the substrate, so that the semiconductor device is fixed with the substrate through the tin paste. According to the die bonder, metal bonding of electrodes between the semiconductor device and the substrate is achieved by silk-screen printing of the tin paste on the substrate through the tin paste, so that the problem that the glue amount of a traditional die bonder is difficult to control is solved; and the yield of a product is improved. The die bonder can automatically identify the substrate and the semiconductor device, so that the tin paste can be accurately printed; the semiconductor can be accurately grabbed, fixed and placed; and the quality of the product is further improved.
Description
technical field [0001] The invention relates to semiconductor packaging technology, in particular to a solid crystal machine. Background technique [0002] Traditional die bonders are used to make electrical connections between semiconductor devices and substrates. Traditional die-bonding machines can bond semiconductor devices to substrates with conductive silver paste or non-conductive adhesives. Then a baking process is performed to cure the semiconductor device bonded by the conductive silver paste or the non-conductive adhesive. Finally, under the action of thermocompression and ultrasonic, the substrate and the semiconductor device are connected by gold wire (copper wire or silver alloy wire) through a wire bonding machine, so as to realize the electrical connection between the semiconductor device and the substrate. [0003] However, the amount of glue in the traditional die bonder is not easy to control, and the uniformity and consistency are not very good. If the...
Claims
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IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 李健乔家平罗诚罗波高云峰
Owner 深圳市大族封测科技股份有限公司