Supercharge Your Innovation With Domain-Expert AI Agents!

Circuit board machining method and circuit board

A processing method and circuit board technology, which is applied in the direction of printed circuit, printed circuit manufacturing, printed circuit components, etc., can solve the problems of unfavorable PCB surface to run fine lines, occupy PCB surface wiring space, increase manufacturing cost, etc., and achieve great convenience Effect of current loading, superior conductivity, and strong current-carrying capacity

Active Publication Date: 2016-03-30
SHENNAN CIRCUITS
View PDF5 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The PCB with the above-mentioned porous parallel input and output current design includes multiple PTH holes densely distributed. For PCB power boards that need to lay out fine lines, these densely distributed PTH holes will occupy too much PCB surface wiring space, which is not conducive to the PCB surface layer. Take fine lines, and it will also lead to prolonging the production process, increasing manufacturing costs, and complicating process control

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit board machining method and circuit board
  • Circuit board machining method and circuit board
  • Circuit board machining method and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a circuit board, which may include:

[0024] 110. Processing current conduction holes on the circuit board.

[0025] The circuit board mentioned in the embodiment of the present invention may be a circuit board of any structure manufactured by any prior art. Preferably, the circuit board is a circuit board for power supply products, which has at least one thick copper circuit layer for carrying large current. The thickness of said thick copper circuit layer can be more than 10 ounces (OZ, 1OZ equals approximately 35 microns), and can be used to carry a current greater than or equal to 5A. A variety of metallized through holes generally need to be designed on the circuit board to realize interlayer transmission of current or signals. Various metallized vias include: current vias used to transfer current between layers, and signal vias used to transfer signals between lay...

Embodiment 2

[0040] Please refer to image 3 , the embodiment of the present invention also provides another circuit board processing method, which may include:

[0041] 310. Processing current conduction holes on the circuit board.

[0042]The circuit board mentioned in the embodiment of the present invention may be a circuit board of any structure manufactured by any prior art. Preferably, the circuit board is a circuit board for power supply products, which has at least one thick copper circuit layer for carrying large current. The thickness of the thick copper circuit layer can be more than 10 ounces (OZ, 1OZ is approximately equal to 35 microns), and can be used to carry a current greater than or equal to 5A. A variety of metallized through holes generally need to be designed on the circuit board to realize interlayer transmission of current or signals. Various metallized vias include: current vias used to transfer current between layers, and signal vias used to transfer signals be...

Embodiment 3

[0055] Please refer to Figure 2a-2d , the embodiment of the present invention provides a circuit board 20 .

[0056] The circuit board 20 has a current conduction hole 21 , and a conductive resin 23 is cured in the current conduction hole 21 .

[0057] The circuit board provided in this embodiment can be manufactured by the method disclosed in the first embodiment above. For a more detailed description of the circuit board 20 , please refer to the content recorded in the first embodiment.

[0058] It can be seen from the above that the embodiment of the present invention discloses a circuit board. The circuit board achieves the following technical effects by inserting conductive resin into the current conduction hole:

[0059] First, because the conductive resin or metal post is inserted into the current conduction hole, the current conduction cross section is increased, so the current conduction hole can carry a larger current, thus, the circuit board no longer needs dense ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An embodiment of the invention discloses a circuit board machining method to improve the current carrying capacity of PTHs and reduce the number of PTHs in a circuit board so as to reduce the occupied space by the wiring on a surface layer of the circuit board, reduce the complexity of the process control, reduce production processes and lower the production cost. The embodiment of the invention further provides a corresponding circuit board. In some viable embodiments of the invention, the method comprises the steps of machining current conducting holes in the circuit board; plugging conductive resin into the current conducting holes and curing; electroplating the circuit board, and forming an electroplated layer on the surface of the circuit board; and machining an outer layer pattern on the surface of the circuit board.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a circuit board processing method and the circuit board. Background technique [0002] One of the main functions of printed circuit boards (Printed Circuit Board, PCB, referred to as circuit boards) for power products is to convert high DC or AC voltages into low DC or AC voltages, which involves large currents on the PCB (such as 5- 30A), and the inner layer of the PCB needs to connect the external input and output ports through the metallization hole (PlatingThroughHole, PTH). [0003] Due to the rigid index requirements of current carrying capacity, as well as the limitation of space and cost, PTH holes need enough copper cross-sectional area to carry current, but the thickness of copper in a single PTH hole is limited. Therefore, generally for PTH holes carrying current, high hole Copper thickness (≥40um), porous parallel input and output currents are conducted, while...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
Inventor 黄立球刘宝林沙雷
Owner SHENNAN CIRCUITS
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com