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Manufacturing method for circuit board with embedded magnetic core

A technology of printed circuit board and manufacturing method, which is applied in the direction of printed circuit, printed circuit, assembling printed circuit with electrical components, etc., can solve the problems of magnetic core cracking, magnetic core not shaking, etc., so as to reduce the overall cost and reduce the number of solder joints. number, the effect of improving limitations

Inactive Publication Date: 2016-03-30
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For this reason, the technical problem to be solved by the present invention is that in the existing printed circuit board manufacturing process with embedded magnetic cores, after the copper on the surface of the core board is etched, the slots for accommodating the magnetism are milled out, and then pressed together to obtain the The magnetic core of the product cannot be shaken, and it is easy to cause the magnetic core to break during the pressing process; thus a method for manufacturing printed circuit boards with embedded magnetic cores is proposed

Method used

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  • Manufacturing method for circuit board with embedded magnetic core

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Embodiment

[0025] This embodiment provides a method for manufacturing a printed circuit board with a buried magnetic core, which includes the following steps:

[0026] S1, the previous process, provide the magnetic core, copper-clad core board, and prepreg 3, and cut the copper-clad core board and prepreg, and cut out the required size, such as figure 1 As shown, in this embodiment, the copper-clad core board and the prepreg 5 are made of FR4 material, including two copper-clad core boards, that is, the first copper-clad core board 1 and the second copper-clad core board 2, and a prepreg 5;

[0027] S2. Etching the copper foil, etching away the copper foil on the inside of the copper clad core board layer where the magnetic core is located close to the circuit board. In this embodiment, the lower layer copper foil 3 and the second clad The upper copper foil 3 of the copper core board 2;

[0028] S3. Controlled deep milling of the copper clad core board to form the magnetic core groove ...

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Abstract

The invention discloses a manufacturing method for a circuit board with an embedded magnetic core. The manufacturing method comprises the following steps: S1, performing a front process, and cutting a copper-coated core plate and a prepreg; S2, etching a copper foil, wherein the copper foil, close to the inner side of the circuit board, of the copper-coated core plate where the magnetic core is positioned is etched off; S3, milling a magnetic core slot in the copper-coated core plate in a depth-control manner, wherein the section of the magnetic core slot adopts a circular ring shape; S4, windowing the prepreg; S5, laminating; and S6, performing a back process. The laminating structure is adjusted; the magnetic core slot is milled from the copper-coated surface to the etching surface in the step of milling the magnetic core slot in the copper-coated core plate in a depth-control manner, so that the depth of the slot is accurate, and the condition that the magnetic core is fractured easily is reduced; and meanwhile, the inner circle diameter of the section circular ring of the magnetic core slot is less than the inner diameter of the magnetic core while the outer circle diameter of the section circular ring of the magnetic core slot is larger than the outer diameter of the magnetic core, so that a movable space is reserved for the magnetic core, and the limitation causing the condition that magnetic core is fractured easily is further reduced.

Description

technical field [0001] The invention belongs to the technical field of printed circuit board manufacture, and in particular relates to a method for manufacturing a printed circuit board with embedded magnetic cores. Background technique [0002] With the development trend of high-density miniaturization of electronic hardware, the surface area of ​​the printed circuit board (PCB) is increasingly reduced. At the same time, the components mounted on the surface of the circuit board are not reduced. etc.) account for 70%-90% of the number of components in the circuit board and 70%-80% of the substrate area. In order to meet the increase in the density of such mounted components and the requirements for high performance of electronic products, the The technology of embedding passive components inside the circuit board, if this technology is widely used, the size of the product can be further reduced significantly. [0003] At present, the embedded magnetic core printed circuit ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/30
CPCH05K3/30H05K2201/1003
Inventor 翟青霞王小军李金龙容亮斌
Owner SHENZHEN SUNTAK MULTILAYER PCB
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