Anodized Architecture for Plating Adhesion

Abstract

For manufacturing a chamber component for a processing chamber, a first anodized layer is formed on a metal article with impurities, the first anodized layer has a thickness greater than about 100 nm, and on the first anodized layer An aluminum coating is formed that is substantially free of impurities. A second anodized layer may be formed on the aluminum coating.

Description

Technical field [0001] Embodiments of the present disclosure generally relate to aluminum-coated articles and a process for applying an aluminum coating to a substrate. Background technique [0002] In the semiconductor industry, devices are manufactured through many manufacturing processes that produce structures of increasingly reduced dimensions. Some manufacturing processes (such as dry etching) may generate particles and metal contamination on the substrate being processed, thereby causing device defects. As device geometries shrink, sensitivity to these defects increases, and particle and metal contamination requirements become stricter. Therefore, as the geometry of the device shrinks, the allowable level of particle defects and metal contamination may decrease significantly. Summary of the invention [0003] In one embodiment, a first anodized layer having a thickness greater than about 100 nm is formed on a metal product including impurities and inclusions, and aluminum...

AI Technical Summary

Problems solved by technology

Therefore, as device geometries shrink, the level of tolerable particle defects and metal contamination can be significantly reduced

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