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A kind of porous micron copper ball and its preparation method

A technology of copper balls and copper sources, applied in the field of porous micron copper balls and their preparation, can solve the problems of complicated preparation process operation, long production cycle, simple preparation process, etc., and achieves simple and easy operation of the process flow, green and mild reaction conditions, The effect of high monodispersity

Active Publication Date: 2019-01-01
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has the disadvantages of complex preparation process, high cost, and long production cycle, which is not suitable for large-scale industrial production.
At present, there is no report on the preparation of copper-silver alloy nanomaterials that has a simple preparation process, low cost, and can be applied to large-scale production.

Method used

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  • A kind of porous micron copper ball and its preparation method
  • A kind of porous micron copper ball and its preparation method
  • A kind of porous micron copper ball and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Add 3.2g of copper nitrate, 5mL of polypropionic acid, and 8mL of triethylamine into 80mL of ethanol solvent in sequence, stir well and then add 3mL of hydrazine hydrate. After reacting at room temperature for 60min, centrifuge and wash 4 times with 8000r / min deionized water, and take the precipitate in a vacuum Dry at room temperature for 6 hours under the condition that the density is less than 0.01MPa to obtain porous micron copper balls.

[0029] Get the porous micro-copper ball obtained above, adopt X-ray diffractometer (XRD) to carry out phase spectrum analysis to it, adopt field emission scanning electron microscope (SEM) to observe the morphology of particle, adopt specific surface area analyzer (BET) to test The specific surface area of ​​the particles, the results are as follows figure 1 , figure 2 with image 3 shown. from figure 1 The characteristic peaks of metal copper can be seen in , without any characteristic peaks of the second phases such as cupr...

Embodiment 2

[0031] Add 5.5g of copper hydroxide, 8mL of polyacrylic acid, and 5mL of trioctylamine into 450mL of diethylene glycol solvent in sequence, stir evenly, add 5mL of hydrazine hydrate, react at room temperature for 100min, and then centrifuge and wash with 6000r / min deionized water for 4 The second time, take the precipitate and dry it at room temperature for 8 hours under the condition that the vacuum degree is less than 0.01MPa to obtain porous micron copper balls.

[0032] The XRD pattern, SEM pattern and nitrogen isothermal adsorption curve of the prepared copper-silver alloy nanosheets are similar to those in Example 1, showing that the phase of the porous micron copper balls is metallic copper, without other impurities; the size is 60-80nm The pores are evenly distributed, the particle size of the microspheres is uniform, the dispersion is good, and there is no obvious agglomeration.

Embodiment 3

[0034] Add 2.1g of copper acetylacetonate, 3mL of lauric acid, and 5mL of tetraethylenepentamine into 100mL of glycerol solvent in sequence, stir well and then add 10mL of hydrazine hydrate. After reacting at room temperature for 180min, centrifuge and wash with 5000r / min deionized water for 4 times. Take the precipitate and dry it at room temperature for 10 h under the condition that the vacuum degree is less than 0.01 MPa to obtain porous micron copper balls.

[0035] The XRD pattern, SEM pattern and nitrogen isotherm adsorption curve of the prepared copper-silver alloy nanosheet are similar to those in Example 1, showing that the phase of the porous micron copper ball is metallic copper, without other impurities; the size is 60-80nm The pores are evenly distributed, the particle size of the microspheres is uniform, the dispersion is good, and there is no obvious agglomeration.

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Abstract

The invention provides a multi-hole micrometer copper ball and a preparation method thereof. The preparation method includes the following steps of adding a copper source, an organic acid complexing agent and an organic amine complexing agent in solvent, adding reducing agent hydrazine hydrate to react after the mixture is evenly stirred, conducting centrifugation, taking sediment, and conducting washing and vacuum drying to obtain the multi-hole micrometer copper ball. A multi-hole copper material is prepared through wet method chemical reduction, raw materials low in price serve as reactant, the reaction conditions are environmentally friendly and gentle, the technological process is simple and easy to operate, and the generated multi-hole micrometer copper ball is good in dispersity, high in single dispersity and capable of being produced on a large scale and applied to the fields of efficient catalysis and antibiosis.

Description

technical field [0001] The invention relates to the technical field of nanometer metal materials, in particular to a porous micron copper ball and a preparation method thereof. Background technique [0002] Porous micro-nano metals are materials with pore sizes on the micro-nano scale. Compared with traditional porous metals, their pore sizes are smaller and their specific surface areas are higher, so they have special physical and chemical properties. They are used in catalysis, separation, sensors, and vibration reduction It has a wide range of applications in buffering and surface Raman enhancement. [0003] At present, the preparation methods of porous micro-nano metal materials mainly include template method, deposition method, powder metallurgy method, dealloying method and so on. The template method uses colloidal crystals as a template, fills the pores of the template material with the raw material of the porous material, and then removes the template material by a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/24
CPCB22F9/24
Inventor 朱朋莉张昱李刚赵涛孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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