Laser sealing welding process of a composite aluminum alloy shell

An aluminum alloy shell, sealed welding technology, applied in laser welding equipment, welding equipment, metal processing and other directions, can solve the problems of complex circuit and bare chip structure, substandard mechanical properties of joints, affecting yield and reliability, etc. The effect of small thermal deformation, low cost and high processing speed

Active Publication Date: 2017-09-26
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The cover plate of the aluminum alloy microwave component shell used for airtight packaging usually adopts the grade of 4047 or 4A11, and the shell generally adopts the aluminum alloy of the grade 6061 or 6063. The 6061 and 6063 aluminum alloys belong to the 6 series Al-Mg-Si aluminum Alloy has good plasticity and weldability, but its corrosion resistance is average, which affects the yield and reliability of the product. It must increase its corrosion resistance by oxidation and other means, thus increasing the cost
The 5A05 aluminum alloy belongs to the Al-Mg series anti-rust aluminum alloy, which is characterized by excellent corrosion resistance and good plasticity, but the general laser welding process is prone to various welding defects, such as weld seam Pores exceeding standards, slag inclusions, mechanical properties of joints not up to standard, etc.
Due to the complex structure and high cost of the circuit and bare chip inside the electronic device and component, a suitable laser welding process is studied to realize the composite aluminum alloy electronic device with the 5A05 aluminum alloy shell and the 4047 or 4A11 cover plate. and hermetic encapsulation of component housings are of great importance

Method used

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  • Laser sealing welding process of a composite aluminum alloy shell
  • Laser sealing welding process of a composite aluminum alloy shell

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Embodiment 1

[0031] In this embodiment, the composite aluminum alloy shell to be laser sealed and welded is 30 mm × 30 mm, and the inner cavity volume is about 3.7 cm 3 , the composite aluminum alloy shell includes a 5A05 aluminum alloy shell and a 4047 aluminum alloy cover plate, the welded joints are butt jointed, the thickness of the cover plate is 1mm, and the fit gap between the shell and the cover plate is 0.06mm. like figure 1 As shown, the laser sealing welding process of the composite aluminum alloy shell of the present invention comprises the following steps:

[0032] (1) Cleaning: Soak the composite aluminum alloy casing with methanol and isopropanol in sequence. After soaking, wipe the inside and outside of the composite aluminum alloy casing with dust-free paper to remove oil stains on the surface of the casing, and then dry the casing with nitrogen.

[0033] (2) Vacuum baking: place the cleaned composite aluminum alloy shell on a heating plate in a vacuum oven, and bake the ...

Embodiment 2

[0040] In this embodiment, the composite aluminum alloy shell to be sealed and welded by laser is 30mm×30mm, and the inner cavity volume is about 3.4cm 3 , The composite aluminum alloy shell includes a 5A05 aluminum alloy shell and a 4A11 aluminum alloy cover plate. The welded joint adopts a butt joint method. The thickness of the cover plate is 1mm, and the fit gap between the shell and the cover plate is 0.08mm. like figure 1 As shown, the laser sealing welding process of the composite aluminum alloy shell of the present invention comprises the following steps:

[0041] (1) Cleaning: Soak the composite aluminum alloy casing with methanol and isopropanol in sequence. After soaking, wipe the inside and outside of the composite aluminum alloy casing with dust-free paper to remove oil stains on the surface of the casing, and then dry the casing with nitrogen.

[0042] (2) Vacuum baking: place the cleaned composite aluminum alloy shell on a heating plate in a vacuum oven, and ba...

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Abstract

The invention discloses a laser seal welding technology of a composite aluminum alloy shell. The laser seal welding technology comprises the following steps of 1, visual alignment; 2, laser spot welding locating, wherein laser spot welding of a plurality of equal-distance spots is carried out on all the edges of a seam of the aluminum alloy shell and an aluminum alloy cover plate, so that the aluminum alloy shell and the aluminum alloy cover plate are fixed; and 3, laser seal welding, wherein laser seal welding is carried out on the seam of the aluminum alloy shell and the aluminum alloy cover plate, and according to the technological parameters of laser seal welding, the laser pulse peak power is 1,700 W-2,200 W, the pulse waveform is rectangular waves, the pulse width is 2 ms-4 ms, the pulse repetition frequency is 10 Hz-30 Hz, the welding speed is 108 mm / min-270 mm / min, and the defocusing amount ranges from -2 mm to 0 mm. Cracks and air holes at the laser welding seam of the composite aluminum alloy shell can be effectively eliminated, and the packaged composite aluminum alloy shell has the advantages of being attractive in welding seam appearance, high in airtightness, reliability and efficiency, low in cost and the like.

Description

technical field [0001] The invention mainly relates to the technical field of packaging and testing technology of micro-assembled components, in particular to a laser sealing welding technology suitable for composite aluminum alloy shells. Background technique [0002] With the rapid development of modern advanced integrated circuits and microwave technology, the packaging quality of electronic devices and components has an increasing impact on the performance of the overall system. According to statistics, among the factors currently limiting the performance of microwave devices, 30% of device failures are related to electronic packaging. Packaging not only has the function of mechanical support and environmental protection for the chip, but also prevents it from being polluted and eroded by moisture, impurities and various chemical atmospheres in the atmosphere, so that the internal chip of the device can stably perform normal electrical functions; And the thermal perform...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/24B23K26/32B23K26/12B23K26/0622B23K26/03B23K26/60B23K103/10B23K101/36
CPCB23K26/032B23K26/123B23K26/206B23K26/24B23K2101/36B23K2103/10
Inventor 赵瓛邓斌万喜新王学仕周水清杨金文正何永平
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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