Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for eliminating edge squeezed-out resin of buried-copper-coin PCB

A copper block and glue overflow technology, which is applied in the secondary treatment of printed circuits, electrical components, printed circuits, etc., can solve the problems of cleaning, difficult glue overflow, grinding and leaking substrates, etc., so as to improve the quality of board making and reduce scrap rate effect

Inactive Publication Date: 2016-04-13
SHENZHEN SUNTAK MULTILAYER PCB
View PDF3 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the copper block will form a certain drop with the board surface during pressing, it is difficult to clean up the overflowing glue with the current method, and it is easy to cause leakage of the base material at other positions

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for eliminating edge squeezed-out resin of buried-copper-coin PCB
  • Method for eliminating edge squeezed-out resin of buried-copper-coin PCB
  • Method for eliminating edge squeezed-out resin of buried-copper-coin PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] See image 3 In this embodiment, the hole diameter of the drill holes is 0.15mm, and the arrangement rules of the drill clusters are specifically as follows: each drill cluster includes the inner ring standard drilling and the outer ring standard drilling, the inner ring standard drilling The 6 standard boreholes are arranged in a circular arrangement. The standard boreholes of the inner ring all intersect at point O, and are symmetrical with point O as the center of symmetry. The overlap ratio of the standard boreholes of adjacent inner rings is 50%; The holes are arranged in a circular arrangement with 12 standard drilling holes. All outer ring standard drilling holes are symmetrical with point O as the center of symmetry. The distance from the center of all outer ring standard drilling holes to point O is twice the standard drilling radius. 42 is the standard drill diameter, 43 is the width of the drill cluster.

[0042] Using the above-mentioned arrangement rule of dri...

Embodiment 2

[0044] See Figure 4 In this embodiment, the hole diameter of the drill holes is 0.175mm, and the arrangement rules of the drill clusters are specifically as follows: each drill cluster includes the inner ring standard drilling and the outer ring standard drilling, the inner ring standard drilling consists of 3 The standard boreholes are arranged in a circular arrangement. All the standard boreholes in the inner ring intersect at point O, and are symmetrical with point O as the center of symmetry. The angle formed by the line connecting the center of adjacent standard boreholes and point O is 120°; The standard boreholes of the outer ring are arranged in a circular arrangement. All the standard boreholes of the outer ring are symmetrical with the point O as the center of symmetry. The standard boreholes of the adjacent outer ring are tangent. The distance from the center of the circle to point O is twice the standard drilling radius.

[0045] Using the above arrangement rule of ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method for eliminating edge squeezed-out resin of a buried-copper-coin PCB. The method comprises the following steps of S1, setting an operation parameter of a laser drilling machine according to the thickness and width of the resin which is squeezed out of the buried-copper-coin PCB; S2, performing firming on the squeezed-out resin around the buried-copper-coin PCB by means of the laser drilling machine according to the operation parameter; and S3, grinding a carbide generated after firing the squeezed-out resin around the buried-copper-coin PCB by the laser drilling machine and the residual squeezed-out resin, thereby eliminating the carbide and the residual squeezed-out resin from the PCB; and a step of checking whether residual squeezed-out resin exists at the periphery of the buried-copper-coin PCB, and repeating the steps S1 to S3 until the squeezed-out resin is totally eliminated. The method of the invention has advantages of efficiently eliminating the edge squeezed-out resin of the buried-copper-coin PCB, reducing board surface wearing of the PCB, improving quality of manufactured PCB, and reducing rejection rate of the PCB.

Description

Technical field: [0001] The invention relates to the technical field of circuit boards, in particular to a method for removing glue overflow at the edge of a PCB embedded copper block. Background technique: [0002] With the development of the electronics industry, the volume of electronic products is getting smaller and smaller, the device layout is concentrated, the spacing is smaller, the power of the components is increased, especially the high-power heating devices, which will put forward requirements on the heat dissipation capacity of the PCB board. However, the structure of the traditional PCB board can no longer meet this requirement, so there are many ways to solve the heat dissipation problem of the PCB board in the industry, such as the use of high thermal conductivity materials, metal base & core board, and thick copper PCB board. [0003] At present, a copper-embedded PCB board technology with local heat dissipation has appeared. This process makes the PCB board embed...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/22
CPCH05K3/22H05K2201/10416H05K2203/107
Inventor 赵波翟青霞刘东
Owner SHENZHEN SUNTAK MULTILAYER PCB
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com