Pressure sensor, pressure detection method and manufacturing process
A sensor and manufacturing method technology, applied in the direction of instruments, measuring force, measuring devices, etc., can solve the problems of limited sensitivity, high production cost, size and thickness limitation, etc., and achieve the effect of accurate measurement results, good electrical conductivity, and simple structure
Active Publication Date: 2016-04-20
常州二维光电科技有限公司
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Problems solved by technology
[0002] Pressure sensors are widely used in the intelligent manufacturing industry, but the existing pressure sensors have too complicated sensing methods and internal structures, require extremely sophisticated electronic control systems, and the production costs are too high, and the size and thickness are limited, making it impossible to manufacture The ultra-thin pressure sensor has extremely limited sensitivity and cannot accurately measure the precise micro-pressure
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Embodiment 1
[0031] See figure 1 , a pressure-sensitive sensor of this embodiment includes an upper substrate 1, a lower substrate 2, a body circuit layer 3 and a lead-out electrode 4; the upper substrate 1 and the lower substrate 2 are elastic organic materials, and one side thereof has the same three-dimensional structure, and The side with the three-dimensional structure is oppositely arranged; the body circuit layer 3 is flexible, and a conductive material is arranged on it to make a conductive circuit layer; the body circuit layer 3 is sandwiched between the upper substrate 1 and the lower substrate 2, and evenly covers the upper substrate 1 and On the three-dimensional structure of the lower substrate 2 , electrodes 4 are respectively drawn out from both ends of the body circuit layer 3 . The cross-section of the three-dimensional structures on the upper base 1 and the lower base 2 is a continuous V-shape with the same size; or the cross-section is a continuous U-shape with the same ...
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Abstract
The invention discloses a pressure sensor, a pressure detection method and a manufacturing process. The pressure sensor comprises an upper substrate, a lower substrate, a body circuit layer and extraction electrodes. The upper substrate and the lower substrate are prepared by elastic organic materials, wherein one side of the upper substrate and one side of the lower substrate are of a same three-dimensional structure, and are opposite; the body circuit layer is flexible, and is provided with a conductive line layer prepared by conductive materials; the body circuit layer is clamped between the upper substrate and the lower substrate, and covers the three-dimensional structures of the upper substrate and the lower substrate according to a function plane circuitous pattern substrate; two ends of the body circuit layer respectively lead out the extraction electrodes. According to the invention, base material stereoscopic deformation is generated through the force applied to the flexible substrate surface of the sensor, and meanwhile, the stereoscopic circuit structure in base materials forms stereoscopic deformation, and thereby resistance change is formed; according to resistance change, pressure values are calculated; the pressure sensor has the characteristics of simple structure, accurate measuring result and high sensitivity.
Description
technical field [0001] The invention relates to a pressure sensitive sensor, a pressure detection method and a manufacturing process. Background technique [0002] Pressure sensors are widely used in the intelligent manufacturing industry, but the existing pressure sensors, sensing methods and internal structures are too complicated, require extremely precise electronic control systems, the production cost is too high, and the size and thickness are limited, making it impossible to do The sensitivity of the ultra-thin pressure sensor is also extremely limited, and it cannot accurately measure the precise micro pressure. SUMMARY OF THE INVENTION [0003] The first object of the present invention is to provide a pressure-sensitive sensor capable of sensitively detecting minute pressure. [0004] The technical solution to achieve the first object of the present invention is a pressure-sensitive sensor, which includes an upper substrate, a lower substrate, a body circuit laye...
Claims
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Login to View More IPC IPC(8): G01L1/22
CPCG01L1/225G01L1/2293
Inventor 金虎尉长虹
Owner 常州二维光电科技有限公司