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High heating flux module heat dissipation method combining uniform temperature plate and liquid cooling

A technology of high heat flux density and heat dissipation method, which is applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve difficult and severe heat dissipation problems, and achieve the effect of avoiding local heat accumulation

Inactive Publication Date: 2016-04-20
SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Especially when there are high-power devices on the top and bottom sides of the board, the heat dissipation problem is more serious. It is difficult to solve the heat dissipation problem by embedding heat pipes in the conventional cold plate

Method used

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  • High heating flux module heat dissipation method combining uniform temperature plate and liquid cooling
  • High heating flux module heat dissipation method combining uniform temperature plate and liquid cooling

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A heat dissipation method for high heat flux modules combining vapor chamber and liquid cooling. The method uses high-efficiency liquid cooling on the main heat dissipation surface of the high heat flux module to dissipate heat quickly; The vapor chamber with super heat transfer performance on the two-dimensional plane dissipates heat, realizes the two-dimensional thermal expansion of the heat source, achieves temperature uniformity on the entire two-dimensional surface, and avoids local heat accumulation.

Embodiment 2

[0022] Such as figure 1 , 2 As shown, on the basis of Example 1, the structure of the high heat flux module described in this embodiment: the circuit board 3 is installed between the cold plate 1 and the uniform temperature plate 2, and the left and right sides of the high heat flux module are provided with wedge-shaped The locking mechanism 4 uses the wedge-shaped locking mechanism 4 to install the high heat flux density module into the chassis, the vapor chamber 2 and the chassis wall 9 are closely attached, and the heat is transferred from the heating element → the vapor chamber 2 → the chassis wall 9, Solve the heat dissipation of the secondary heat dissipation surface.

Embodiment 3

[0024] On the basis of Embodiment 2, the vapor chamber 2 described in this embodiment is provided with a boss 8 at a position opposite to the high power consumption chip 7 to realize bonding of the chip 7 and the vapor chamber 2 .

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Abstract

The invention discloses a high heating flux module heat dissipation method combining a uniform temperature plate and liquid cooling. According to the method, a primary heat dissipating surface of a high heating flux module is cooled through liquid cooling; a secondary heat dissipating surface is cooled through the uniform temperature plate, two-dimensional heat spreading of a heat source is realized, temperature uniformity of the whole two-dimensional surface is realized, and gathering of local heat is avoided. According to the method, the primary heat dissipating surface is cooled through efficient liquid cooling, and heat is taken away rapidly; the secondary heat dissipating surface is cooled through the uniform temperature plate with ultrahigh heat transfer performance on the two-dimensional plane, two-dimensional heat spreading of the heat source is realized, the temperature uniformity of the whole two-dimension surface is realized, and gathering of local heat is avoided.

Description

technical field [0001] The invention relates to the technical field of computer heat dissipation, in particular to a high heat flux density module heat dissipation method combined with a vapor chamber and liquid cooling. Background technique [0002] The CPU and other components of the computer will generate heat during high-speed operation. Heat dissipation is actually a process of heat transfer. The purpose is to transfer the heat generated by the CPU and other components to other media and control the temperature of the CPU and other components within a stable range. within. According to the environment we live in, the heat of the CPU and other components will eventually be dissipated into the air. This process is the cooling of the computer. [0003] And the heat transfer process between them is the role of the radiator. [0004] All radiators dissipate heat mainly by heat conduction and heat convection. According to the different means of heat conduction and heat con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201G06F2200/203
Inventor 李圣路龚振兴
Owner SHANDONG CHAOYUE DATA CONTROL ELECTRONICS CO LTD