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Etching method, etching system and preparation method of PCB

A PCB board and etching technology, which is applied in the field of PCB board preparation, can solve the problems of poor uniformity of prefabricated lines, etc., and achieve the effect of accelerating etching speed, increasing speed, and increasing contact area

Inactive Publication Date: 2016-04-20
ZHUHAI FOUNDER TECH MULTILAYER PCB +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Therefore, the technical problem to be solved by the present invention lies in the defect that the PCB board etching method in the prior art makes the uniformity of the prefabricated circuit formed on the surface of both sides of the substrate poor, thereby providing a method that can improve the uniformity of the prefabricated circuit on the surface of both sides of the substrate. Etching method, etching system

Method used

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  • Etching method, etching system and preparation method of PCB
  • Etching method, etching system and preparation method of PCB
  • Etching method, etching system and preparation method of PCB

Examples

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Effect test

Embodiment 1

[0069] The present embodiment provides a kind of processing method of circuit side wall of PCB board, as figure 1 shown, including the following steps:

[0070] S11: facing the first surface 11 of the substrate 1 downward toward the etching solution;

[0071] S12: Etching away the copper plating layer at the non-prefabricated circuit on the first surface 11 with an etching solution;

[0072] S13: Flipping the substrate 1 so that the second surface 12 of the substrate 1 opposite to the first surface 11 faces downward toward the etching solution;

[0073] S14: Etching away the copper plating layer on the second surface 12 at the non-prefabricated circuit by using an etching solution.

[0074] The etching method of the above-mentioned PCB board, when etching the copper-plated layer at the non-prefabricated circuit place on the first surface 11 and the second surface 12 of the substrate 1, it is carried out in two times, first to the first surface of the substrate 1 facing downw...

Embodiment 2

[0083] The present embodiment provides a kind of etching system of PCB board, as figure 2 shown, including

[0084] The conveying device 2 is used to support the substrate 1 and can drive the substrate 1 to move;

[0085] Spraying device, at least one, for spraying etching solution to the surface to be etched of the substrate 1;

[0086] The overturning device 3 is used for overturning the substrate 1 so that the surface to be etched of the substrate 1 faces downward toward the showering device.

[0087] The etching system of the above-mentioned PCB board can only etch the copper plating layer at the non-prefabricated circuit on the downward surface of the substrate 1 at a time. After the etching of the downward surface is completed, the turning device 3 turns the upward surface of the substrate 1 into downward, and then etch the surface; in this way, it can be avoided that when two spraying devices are used to etch the downward surface and the upward surface of the substra...

Embodiment 3

[0100] The present embodiment provides a kind of preparation method of PCB board, as image 3 shown, including the following steps:

[0101] S31: forming a hole on the substrate 1;

[0102] S32: forming a copper plating layer on both sides of the substrate 1;

[0103] S33: forming a prefabricated circuit on the surface of the copper plating layer of the substrate 1;

[0104] S34: directing the first surface 11 of the substrate 1 downward toward the etching solution;

[0105] S35: Etching away the copper plating layer at the non-prefabricated circuit on the first surface 11 with an etching solution;

[0106] S36: Flipping the substrate 1 so that the second surface 12 of the substrate 1 opposite to the first surface 11 faces downward toward the etching solution;

[0107] S37: Etching away the copper plating layer on the second surface 12 at the non-prefabricated circuit by using an etching solution.

[0108] In addition, any other PCB board etching method described in Embod...

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Abstract

The invention discloses an etching method, etching system and preparation method of a PCB. The etching method includes the following steps that: the first surface of a substrate is arranged downwards to face an etching solution, and the etching solution etches the first surface; the substrate is turned over, so that the second surface of the substrate which is opposite to the first surface, is arranged downwards to face the etching solution; and the etching solution etches the second surface. The etching system includes a conveying device used for supporting a substrate and can driving the substrate to move, at least one spray device used for spraying an etching solution to the to-be-etched surfaces to the substrate, and a turnover device used for turning over the substrate so as to make the to-be-etched surfaces of the substrate face the spray device. According to the preparation method of a PCB, the above PCB etching method or PCB etching system are adopted to etch two side surfaces of a substrate. The two side surfaces of the substrate are etched in twice, a certain to-be-etched surface faces downwards each time, and therefore, the etching solution will not be deposited on any surface of the substrate, and prefabricated lines at the two side surfaces of the substrate, which are formed by etching, can be identical.

Description

technical field [0001] The invention relates to the technical field of PCB board preparation, in particular to an etching method, an etching device and a preparation method for a PCB board. Background technique [0002] The preparation method of the PCB board in the prior art mainly includes: drilling holes on the substrate of the PCB board, carrying out copper plating treatment to the entire substrate board, forming a copper plating layer on the surfaces of both sides of the substrate; The photosensitive film is covered, and the photosensitive film is exposed and developed to form a prefabricated circuit at the position of the copper plating layer blocked by the photosensitive film on both sides of the substrate; after that, the copper plating layer at the position of the non-prefabricated circuit on both sides of the substrate (that is, the copper plating layer outside the photosensitive film shielding) is etched to display the prefabricated circuits on both sides of the s...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/002H05K2203/0736H05K2203/1563
Inventor 江民权王琦玮
Owner ZHUHAI FOUNDER TECH MULTILAYER PCB
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