Cutting device

Abstract

The invention provides a cutting device. Flown-apart cutting water provided for a cutting processing part will not be atomized. The cutting device is provided with a to-be-processed object keeping unit for keeping a to-be-processed object, a cutting unit, a cutting water supplying unit and a cutting feeding unit. The cutting unit is provided with a cutter used for cutting the to-be-processed object kept by the to-be-processed object keeping unit. The cutting water supplying unit is provided with a cutting water supplying nozzle for providing cutting water for a cutting processing part achieved by the cutter. The cutting feeding unit allows the to-be-processed object keeping unit and the cutting unit to relatively move in a cutting feeding direction. The cutting device is equipped with an atomization restraining unit which restrains a trend that the cutting water flows apart from one side of the cutting processing part caused by rotation of the cutter.

Description

Technical field [0001] The present invention relates to a cutting device for cutting a workpiece such as a semiconductor wafer. Background technique [0002] For example, in the semiconductor device manufacturing process, IC, LSI, etc. are formed on a plurality of regions divided by planned division lines called dicing lines formed in a grid on the surface of a semiconductor wafer having a substantially disc shape. The circuit is divided along a predetermined dividing line to divide each area where the circuit is formed, thereby manufacturing each semiconductor chip. As a dividing device for dividing a semiconductor wafer, a cutting device called a dicer is generally used. The cutting device has: a workpiece holding unit that holds the workpiece; a cutting unit that performs cutting processing on the workpiece held on the workpiece holding unit; and has the workpiece holding unit in the cutting feed direction The cutting feed unit of the cutting blade that feeds the cutting bla...

AI Technical Summary

Problems solved by technology

In this way, when the cutting water supplied to the cutting part scatters and becomes mist, at least the workpiece holding unit, the cutting unit, and the cutting water supply unit are surrounded by a casing made of a transparent material that can be monitored from the outside, but there is mist. The problem that the operator feels uneasy due to the inability to observe the situation inside the casing

[0006] In addition, fine swarf adheres to the entire housing together with the mist, making cleaning difficult, and there is a problem that the accumulated swarf drips onto the wafer held on the workpiece holding unit.

[0007] Furthermore, the fine cutting chips and the mist reach the inside of the device from the casing and adhere to the ball screw mechanism and sliders constituting the cutting feed unit, resulting in a problem of lowering machining accuracy.

[0008] In addition, in the case of recycling expensive cutting water composed of pure water and the like, there is also a problem that the recovery rate of cutting water decreases due to the evaporation of cutting water.

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