Unlock instant, AI-driven research and patent intelligence for your innovation.

A method for machining through holes on an electronic equipment casing and the electronic equipment casing

A technology for electronic equipment and shells, which is applied in the field of electronic equipment shells, and can solve problems such as color differences, long production cycles, and high processing costs

Inactive Publication Date: 2017-12-12
YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for processing a through hole on an electronic equipment casing and the electronic equipment casing, which solves the problems of long production cycle and high processing cost in the existing method, which will burn the base material and the baking paint layer, resulting in obvious color differences

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for machining through holes on an electronic equipment casing and the electronic equipment casing
  • A method for machining through holes on an electronic equipment casing and the electronic equipment casing
  • A method for machining through holes on an electronic equipment casing and the electronic equipment casing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as figure 1 The flow chart of the method for processing through holes on the housing of electronic equipment provided by Embodiment 1 of the present invention, such as figure 1 As shown, the method includes:

[0032] Step A: According to the requirements for processing through holes on the electronic equipment housing and the thickness of the electronic equipment housing, design an injection mold with a blind hole feature, so that the height of the part to be punched on the electronic equipment housing is set to be less than or equal to the electronic equipment 20% of the thickness of the housing, the position of the blind hole feature on the injection mold corresponds to the position of the through hole on the housing of the electronic device;

[0033] Specifically, when processing through holes on the housing of an electronic device, the size, position, quantity, etc. of the through holes need to be determined. If multiple through holes need to be processed, the...

Embodiment 2

[0046] Such as Figure 4 A schematic structural diagram of the housing of the electronic device provided in Embodiment 2 of the present invention, as shown in Figure 4 As shown, the electronic equipment housing is utilized figure 1 Manufactured by the method of processing through holes on the housing of electronic equipment, that is, by injection molding the housing of electronic equipment with blind holes, and secondly, punching the blind holes to obtain through holes. The electronic equipment casing includes at least one through hole, and the through hole is mainly formed through the following methods: one side of the through hole is formed by injection molding, and the other side is formed by stamping.

[0047] In this embodiment, the housing of the electronic device is a battery housing of a mobile terminal, and at least one through hole on the housing of the electronic device is a sound hole with a small pitch and a small diameter, that is, a speaker hole.

Embodiment 3

[0049] The technical solution proposed in this embodiment will be described by taking a straight-through speaker hole with a diameter of 0.5mm and a distance of 1mm between two adjacent holes formed on a PC / ABS mobile phone battery cover with a thickness of 0.9mm as an example.

[0050] S101: According to the thickness of the battery cover of the mobile phone, the diameter of the straight-through speaker hole, and the distance between adjacent holes, determine the structural parameters of the blind hole feature. For example, the height of the blind hole feature is 0.35mm-0.55mm, and the bottom surface diameter is 0.55mm-0.60mm. The draft angle is 1°-3°, and the center distance between two adjacent blind hole features is 1mm;

[0051] S102: Process blind hole features on the injection mold by electrical discharge machining, so that the center of the blind hole features coincides with the center of the straight-through horn hole. After the machining is completed, perform conventi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
heightaaaaaaaaaa
diameteraaaaaaaaaa
Login to View More

Abstract

The invention discloses a method for processing a through hole on an electronic device case and the electronic device case, comprising step A: according to the requirements for processing the through hole on the electronic device case and the thickness of the electronic device case, a blind hole is designed A characteristic injection mold, so that the height of the part to be stamped on the electronic equipment casing is set to be less than or equal to 20% of the thickness of the electronic equipment casing, and the position of the blind hole feature on the injection mold is consistent with the through hole on the electronic equipment casing Corresponding positions; Step B: Injection-molding the electronic equipment housing through an injection mold, so that the inner surface of the electronic equipment housing has blind holes; Step C: Through the stamping mold, from the outer surface of the electronic equipment housing, to the electronic equipment The blind hole in the housing is punched to form a through hole. Through the above technical solutions, the problems of long production cycle, high processing cost, and burnt substrate and paint layer in the existing method are solved, resulting in obvious color differences. The method is simple in operation, short in cycle, low in cost and high in efficiency.

Description

technical field [0001] The invention relates to the technical field of mechanical processing, in particular to a method for processing a through hole on an electronic equipment casing and the electronic equipment casing. Background technique [0002] At present, for some electronic equipment casings, the existing methods generally use CNC (Computer numerical control) machine tools, drilling or laser engraving to form through holes. For example, for the plastic battery cover of a mobile terminal, its main processing The process is to spray paint after plastic injection molding, and finally make horn holes with the help of CNC, drilling or laser engraving and other processing techniques. [0003] However, CNC machine tools, drilling and other machining have long production cycles and high processing costs. For example, for processing a plastic battery cover of about 60 mobile terminals with a diameter of 0.5mm, each processing time is about 2- 3 minutes, each technical cost i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B29C45/26B26F1/02H04M1/02
Inventor 姜贵阳刘兵
Owner YULONG COMPUTER TELECOMM SCI (SHENZHEN) CO LTD